{"companyId":267010,"requestedLanguage":"ja","resolvedLanguage":"ja","availableLanguages":["en","ja","zh-Hant"],"companyName":"南茂テクノロジー株式会社","headOfficeLocation":"新竹科学園区新竹県研究開発一路1号","presidentName":"チョウ セイケイ","companySummary":null,"stockCode":"8150","currency":"TWD","capital":null,"sales":null,"employees":5688,"employeesConsolidated":null,"humanCheck":false,"domains":["chipmos.com"],"businessContents":["半導体のバックエンドテストサービス","パッケージ組立サービス（リードフレームおよび有機基板）","金メッキサービス","ターンキーソリューション","パッケージ設計およびドロップシッピングサービス","信頼性および故障解析","ソフトウェア変換および並列テストプログラム","半導体"],"relations":[{"detailNumber":1,"relationCompanyName":"百慕達南茂科技","relationCompanyId":null,"url":null,"linkUrl":null,"remarks":"関連会社未登録","lastCheckDate":"2026-10-11","raGroup":70,"raParent":70,"raChild":0,"raCustomer":0,"raSupplier":0,"raPartnership":0,"raFinance":0,"raInvest":0}],"dataSources":[{"detailNumber":1,"url":"https://www.chipmos.com/english/about/detail.aspx","scoreAbout":96,"scoreBusiness":30,"scoreGroup":5,"scoreCustomer":2},{"detailNumber":2,"url":"https://www.chipmos.com/chinese/about/detail.aspx","scoreAbout":20,"scoreBusiness":3,"scoreGroup":6,"scoreCustomer":3},{"detailNumber":3,"url":"https://openapi.twse.com.tw/v1/opendata/t187ap03_L","scoreAbout":70,"scoreBusiness":60,"scoreGroup":0,"scoreCustomer":0},{"detailNumber":4,"url":"https://www.chipmos.com","scoreAbout":100,"scoreBusiness":100,"scoreGroup":0,"scoreCustomer":0}]}