Powertech Technology Inc.

Received quality certification from Sharp.

Received quality certification from Sony Green Partner.

Surplus Capital Increase of NT$ 625 million, Paid-in Capital of NT$ 4.005 billion.

Tera Probe, Inc., a joint venture formed in Japan with Elpida, Advantest and Kingston Technology Japan.

Use the “Purchase Method” for simplified merger of 100% owned company, Lijia Investment Ltd.

Received ISO 14001：2004 Environmental Management System Certification.

Started production of MicroSD Card.

MCP packaging process into volume production.

WBGA packaging formally into volume production.

Implemented Green Product (GP) Management System.

Received quality certification from IBM (uBGA).

Received the “2006 Industrial Innovation Outcome Commendation” from the Ministry of Economic Affairs Department of Industrial Technology (MOEA DOIT).

R&D Technology Center Established.

Headquarters (Plant 3) completed for use.

First time issuance of Global Depository Receipts (old shares), listed for trading on the Bourse de Luxembourg.

Surplus Capital Increase of NT$ 750 million, Paid-in Capital of NT$ 4.711 billion.

Received ISO/TS 16949：2002 Certification.

Received land from the Hukuo Industrial Park about 1089 pings, for expansion of future operations.

Hukuo Plant 2B completed for operation.

Started to provide packaging services for Logic IC.

Received license from IBM for Metal Post Solder-Chip Connection (MPS-C2) technology. This is a key technology for fine-pitch Flip Chip packaging.

Surplus Capital Increase of NT$ 7.45 million, Paid-in Capital of NT$ 6.694 billion.

Formed joint venture, TeraPower Technology Inc, with Japanese company Tera Probe, Inc, with paid-in capital of NT$ 750 million, and our company holding 49% of the JV.

Received the “2007 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Ninth in Actual Import/Export.

Received land from the Hukuo Industrial Park about 5,953 pings, for expansion of future operations.

R&D Technology Center Established.

Headquarters (Plant 3) completed for use.

First time issuance of Global Depository Receipts (old shares), listed for trading on the Bourse de Luxembourg.

Surplus Capital Increase of NT$ 386 million, Paid-in Capital of NT$ 6.694 billion.

Paid-in capital increased to NT$ 7,042,366,680 after conversion into common shares by convertible bonds.

Received the “2008 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.

Paid-in capital increased to NT$ 7,153,668,040 after conversion into common shares by convertible bonds.

Received the “2009 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.

Received the “Outstanding Innovation Company Award” portion of the 18th Industry Technology Development Award from the MOEA DOIT.

Acquired Spansion Holdings (Singapore) Pte. Ltd. (name changed to PTI Technology (Singapore) Pte. Ltd.) through Powertech Holding (B.V.I.) Inc., and indirectly obtained Spansion’s MCP packaging and testing plant in Suzhou, China. The China plant was renamed Powertech Technology (Suzhou) Ltd., and the Company formally entered China as a packaging and testing company.

Paid-in capital increased to NT$ 7,264,969,400 after conversion into common shares by convertible bonds.

Formed subsidiary in the Hsinchu Science Park, Macrotech Technology Inc.

Acquired 44% of Greatek Electronics through public tender offer.

During re-election at the extraordinary shareholders' meeting, PTI formally become part of the Greatek Electronics' management.

Institutional director Shiren Investment Company sold more than 50% of company shares owned when it was elected director, so naturally dismissed as company director.

Purchased of company’s treasury stocks for the first time, with a capital reduction of NT$ 200 million, Paid in Capital reduced to NT$ 7,791,466,340.

For effective use of company resources and tax considerations, liquidated US subsidiary Powertech Technology USA Inc.

Established Remuneration Committee.

Elpdia Memory Inc. acquired by Micron Technology Inc. and changed the trading entity to Micron Japan.

Received 2012 Golden Trade Award for 10th place.

Grand Opening for plant3C, and relocated HQ to the new plant.

Legal settlement reached with Tessera Inc. to early terminate product license agreement which help reducing future services costs.

Acquired 100% shares of Nepes Pte. Ltd. Singapore and changed name to Powertech Technology (Singapore) Pte. Ltd.

Signed investment agreements with Micron Inc. for providing packages services in Xian, China.

Merged Macrotech Technology Inc. and established Hsinchu Science Park branch on the site.

Became a member of Electronic Industry Citizenship Coalition (EICC).

Established Powertech Semiconductor (Xian) Co., Ltd.

Signed strategic alliance agreement with Tsinghua Unigroup through private placement.

Received 2015 Golden Trade Award for 4th place.

Received 2016 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.

Certified for ISO 27001 Data Security Management System.

Certified for SA8000 Social Responsibility Management System.

Received 2017 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.

Established Powertech Technology Japan Ltd.

Mutual agreement among Powertech Technology Inc. and Tsianghua Unigroup Co., Ltd., and Tibet TouZhanChaungXin Investment Co., Ltd. authorized to terminate share subscription agreement.

Became a member of Taiwan Alliance for Sustainable Supply and participate in Taiwan packaging and testing industry eco-cloud development program.

Contracted with Micron Inc to acquire its 39.6% holding of Tera Probe, Inc. shares by public tender offer and 100% Micron Akita Inc. operations.

Tera Probe, Inc. became a PTI subsidiary after completed acquisition of Tera Probe, Inc. with 59.44% consolidated holding.

Completed the acquisition of 100% Micron Akita Inc. and name changed to Powertech Technology Akita Inc.

Arranged the Directors and officers Liability Insurance with the coverage of US$30 million in year 2025. The insurance coverage details had been approved in previous Board meeting.