Powertech Technology Inc.
Taiwan
Chip Probing
Final Test
Wafer Level Packaging
Flip Chip Packaging
Wire Bond BGA Packaging
System in Package
Module Assembly
Quality Management
Wire Bond BGA
晶圓凸塊
針測
IC封裝
測試
預燒至成品
固態硬碟封裝
先進面板級扇出型封裝
車用電子
物聯網
先進技術
商標
Flip Chips
Final Test Services for DRAM, NOR Flash, NAND Flash, MCP and Logic Devices
BI Service for Mass Production Products
Testing and BI Program Development
Platform Conversion
Device Correlation
Engineering or Special Lots Support
Test Peripheral Equipment and Spare Parts Development Service
Hsinchu Industrial Park, Taiwan
Mr. Duh Kung Tsai
18,000 人
会社名
Group 親会社 子会社 得意先 仕入先 業務提携 銀行等 株主等
PTI Technology (Singapore) Pte. Ltd.
グループ会社 親会社 子会社 得意先 仕入先 業務提携 銀行・融資・与信 出資・持分・株主
Group 親会社
Powertech Holding (B.V.I.) Inc.
グループ会社 親会社 子会社 得意先 仕入先 業務提携 銀行・融資・与信 出資・持分・株主
Group 親会社
Powertech Technology (Singapore) Pte. Ltd.
グループ会社 親会社 子会社 得意先 仕入先 業務提携 銀行・融資・与信 出資・持分・株主
Group 親会社
晶兆成科技股份有限公司
グループ会社 親会社 子会社 得意先 仕入先 業務提携 銀行・融資・与信 出資・持分・株主
Group
超豐電子股份有限公司
グループ会社 親会社 子会社 得意先 仕入先 業務提携 銀行・融資・与信 出資・持分・株主
Group

65 件
日付概要
2003年03月 Received quality certification from Sharp.
2003年05月 Received quality certification from Sony Green Partner.
2003年09月 Surplus Capital Increase of NT$ 625 million, Paid-in Capital of NT$ 4.005 billion.
2003年09月 Tera Probe, Inc., a joint venture formed in Japan with Elpida, Advantest and Kingston Technology Japan.
2003年12月 Use the “Purchase Method” for simplified merger of 100% owned company, Lijia Investment Ltd.
2003年12月 Received ISO 14001:2004 Environmental Management System Certification.
2003年12月 Started production of MicroSD Card.
2003年12月 MCP packaging process into volume production.
2004年01月 WBGA packaging formally into volume production.
2005年02月 Implemented Green Product (GP) Management System.
2005年03月 Received quality certification from IBM (uBGA).
2006年12月 Received the “2006 Industrial Innovation Outcome Commendation” from the Ministry of Economic Affairs Department of Industrial Technology (MOEA DOIT).
2007年01月 R&D Technology Center Established.
2007年01月 Headquarters (Plant 3) completed for use.
2007年01月 First time issuance of Global Depository Receipts (old shares), listed for trading on the Bourse de Luxembourg.
2007年08月 Surplus Capital Increase of NT$ 750 million, Paid-in Capital of NT$ 4.711 billion.
2007年08月 Received ISO/TS 16949:2002 Certification.
2007年11月 Received land from the Hukuo Industrial Park about 1089 pings, for expansion of future operations.
2008年01月 Hukuo Plant 2B completed for operation.
2008年03月 Started to provide packaging services for Logic IC.
2008年06月 Received license from IBM for Metal Post Solder-Chip Connection (MPS-C2) technology. This is a key technology for fine-pitch Flip Chip packaging.
2008年08月 Surplus Capital Increase of NT$ 7.45 million, Paid-in Capital of NT$ 6.694 billion.
2008年08月 Formed joint venture, TeraPower Technology Inc, with Japanese company Tera Probe, Inc, with paid-in capital of NT$ 750 million, and our company holding 49% of the JV.
2008年09月 Received the “2007 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Ninth in Actual Import/Export.
2008年11月 Received land from the Hukuo Industrial Park about 5,953 pings, for expansion of future operations.
2009年01月 R&D Technology Center Established.
2009年01月 Headquarters (Plant 3) completed for use.
2009年01月 First time issuance of Global Depository Receipts (old shares), listed for trading on the Bourse de Luxembourg.
2009年07月 Surplus Capital Increase of NT$ 386 million, Paid-in Capital of NT$ 6.694 billion.
2009年08月 Paid-in capital increased to NT$ 7,042,366,680 after conversion into common shares by convertible bonds.
2009年08月 Received the “2008 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.
2009年09月 Paid-in capital increased to NT$ 7,153,668,040 after conversion into common shares by convertible bonds.
2009年09月 Received the “2009 Golden Commerce Award” from the MOEA Bureau of Foreign Trade (BFT) for Being Fifth in Actual Import/Export.
2009年09月 Received the “Outstanding Innovation Company Award” portion of the 18th Industry Technology Development Award from the MOEA DOIT.
2009年09月 Acquired Spansion Holdings (Singapore) Pte. Ltd. (name changed to PTI Technology (Singapore) Pte. Ltd.) through Powertech Holding (B.V.I.) Inc., and indirectly obtained Spansion’s MCP packaging and testing plant in Suzhou, China. The China plant was renamed Powertech Technology (Suzhou) Ltd., and the Company formally entered China as a packaging and testing company.
2009年12月 Paid-in capital increased to NT$ 7,264,969,400 after conversion into common shares by convertible bonds.
2010年03月 Formed subsidiary in the Hsinchu Science Park, Macrotech Technology Inc.
2012年02月 Acquired 44% of Greatek Electronics through public tender offer.
2012年04月 During re-election at the extraordinary shareholders' meeting, PTI formally become part of the Greatek Electronics' management.
2012年04月 Institutional director Shiren Investment Company sold more than 50% of company shares owned when it was elected director, so naturally dismissed as company director.
2012年08月 Purchased of company’s treasury stocks for the first time, with a capital reduction of NT$ 200 million, Paid in Capital reduced to NT$ 7,791,466,340.
2012年12月 For effective use of company resources and tax considerations, liquidated US subsidiary Powertech Technology USA Inc.
2012年12月 Established Remuneration Committee.
2013年07月 Elpdia Memory Inc. acquired by Micron Technology Inc. and changed the trading entity to Micron Japan.
2013年09月 Received 2012 Golden Trade Award for 10th place.
2013年11月 Grand Opening for plant3C, and relocated HQ to the new plant.
2014年02月 Legal settlement reached with Tessera Inc. to early terminate product license agreement which help reducing future services costs.
2014年07月 Acquired 100% shares of Nepes Pte. Ltd. Singapore and changed name to Powertech Technology (Singapore) Pte. Ltd.
2014年12月 Signed investment agreements with Micron Inc. for providing packages services in Xian, China.
2014年12月 Merged Macrotech Technology Inc. and established Hsinchu Science Park branch on the site.
2015年04月 Became a member of Electronic Industry Citizenship Coalition (EICC).
2015年05月 Established Powertech Semiconductor (Xian) Co., Ltd.
2015年10月 Signed strategic alliance agreement with Tsinghua Unigroup through private placement.
2016年04月 Received 2015 Golden Trade Award for 4th place.
2016年11月 Received 2016 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.
2016年11月 Certified for ISO 27001 Data Security Management System.
2016年12月 Certified for SA8000 Social Responsibility Management System.
2017年11月 Received 2017 Taiwan Top 50 Corporate Sustainability Report Golden Award in Electronic Information Category.
2018年01月 Established Powertech Technology Japan Ltd.
2018年01月 Mutual agreement among Powertech Technology Inc. and Tsianghua Unigroup Co., Ltd., and Tibet TouZhanChaungXin Investment Co., Ltd. authorized to terminate share subscription agreement.
2018年01月 Became a member of Taiwan Alliance for Sustainable Supply and participate in Taiwan packaging and testing industry eco-cloud development program.
2018年04月 Contracted with Micron Inc to acquire its 39.6% holding of Tera Probe, Inc. shares by public tender offer and 100% Micron Akita Inc. operations.
2018年06月 Tera Probe, Inc. became a PTI subsidiary after completed acquisition of Tera Probe, Inc. with 59.44% consolidated holding.
2018年08月 Completed the acquisition of 100% Micron Akita Inc. and name changed to Powertech Technology Akita Inc.
2025年 Arranged the Directors and officers Liability Insurance with the coverage of US$30 million in year 2025. The insurance coverage details had been approved in previous Board meeting.
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2026-09-03 15:26 (Model: gpt-oss-20b(99) )
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