Die attach pastes for semiconductor packaging
Adhesive tapes for semiconductor package assembly
Positive-type photosensitive coating resins
Epoxy resin molding compounds for semiconductor encapsulation
Epoxy resin coating powders
Liquid epoxy resins for insulation sealing of electronic components
Phenolic resins used in automotive friction materials and other applications
Biotechnology reagents and kits
Optical products for display covers and backlight components
UV-curing dicing tapes for wafer processing
Food packaging films
Laboratory plastic wares (SUMILON®)
Medical device packaging
Non-flammable melamine films
Housing equipment products
Sign and display products
Industrial and commercial products
Waterproofing system products
Construction and agricultural system products
半導体関連材料
クオリティ・オブ・ライフ関連製品
