| 会社名 | Group | 親会社 | 子会社 | 得意先 | 仕入先 | 業務提携 | 銀行等 | 株主等 |
|---|---|---|---|---|---|---|---|---|
| Indium Advanced Materials GmbH | ||||||||
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| Duracell Battery | ||||||||
| PRC Operations | ||||||||
| Macartney Family Foundation | ||||||||
| Rockwell International | ||||||||
| Yunnan Tin Group Company Limited |
In 1863, the element “indium” was discovered by F. Reich and T. Richter while at the Freiburg School of Mines, Germany.
Indium Corporation’s Story Begins Long Before Its Founders Formed a Company in 1934.
Indium Corporation (originally known as The Indium Corporation of America) is founded at 805 Watson Place in Utica, New York. Murray is named President, J. Robert Dyer Jr. is named Vice President, and Gray is named the company’s technical director.
Dyer Jr. develops the process technology and plates the first indium-treated aircraft engine bearing.
Indium Corporation develops a commercially viable process for manufacturing precision solder performs, enabling the mass production of alloy-junction transistors.
The United States Patent Office issues a patent for “Printing Circuits and Method of Soldering the Same.” This invention offers improvements to the process of soldering to printed circuit boards.
Indium Corporation begins the development of solder pastes.
Indium Corporation of Europe is founded.
The United States Patent Office issues a patent for “Method of Forming a Gasket of Indium and Braid.” This patent describes a method of manufacturing a reinforced gasket material known as InFORMS.
Indium Corporation’s Asia-Pacific operation is commissioned in Singapore.
Indium Corporation introduces NC-SMQ92J. This revolutionizes the industry, quickly becoming a world-leading solder paste.
Chicago
Indium Corporation’s Asia-Pacific manufacturing facility expansion project is completed.
Operations commence at Indium Corporation’s Cheongju, South Korea facility.
A patent is granted for Heat-Spring® thermal interfaces materials technology.
Indium Corporation introduces its Indium 8.9HF Halogen-Free Solder Paste.
Indium Corporation introduces its Ultra-Low residue No-Clean semiconductor grade fluxes.
Indium Corporation opens a new tech hub in Penang, Malaysia.
Utica’s Technology Company® expands even further beyond its origins! The headquarters relocates to a larger facility at 301 Woods Park Drive, Clinton, New York, with additional expansion in Penang, Malaysia; Chennai, India; Suzhou, China; Singapore; and Clinton, NY, USA.
Indium Corporation introduces its revolutionary, high-reliability solder paste, Durafuse® LT, to the market.
Indium Corporation of South Korea receives the “10 Million Dollar Export Tower” award from the Korea International Trade Association on the 58th.
Indium Corporation receives the Electronics Maker Leadership Award.
Indium Corporation earns the Best Electronics Assembly Materials Manufacturer of the Year, a Leadership Category Award from Electronics Maker.
Indium Corporation celebrates 90 years and reaches a new benchmark with more than 1,400 employees globally.
Indium Corporation Assistant Product Manager Foo Siang Hooi will present at TestConX China in Suzhou on October 29. The presentation examines factors beyond thermal conductivity that affect compressible indium-based metal TIM performance, including installation time, applied pressure, material thickness, and pattern geometry.
Five Indium Corporation technical experts will share new insights at SMTA International 2026, held October 25–29 in Rosemont, Illinois. Their presentations will address thermal interface materials, defect mitigation, and lead-free assembly protocols. On October 27, Adam Murling will present a back-to-basics session on stencil printing.
Micron announced an investment in critical minerals processing and high-purity materials manufacturing, expected to support the expansion of Indium Corporation’s capabilities in Central New York. The investment is part of Micron’s up to $3 billion U.S. supply-chain plan and is intended to strengthen the domestic semiconductor ecosystem and expand access to materials for advanced memory manufacturing.
Indium Corporation received a Mexico Technology Award in the solder paste category for Indium12.9HF, its no-clean, halogen-free solder paste designed for high-density, fine-pitch assemblies. The award was presented at a breakfast event before the SMTA Guadalajara Tech Forum and Expo in October.
Andreas Karch, Regional Technical Manager and Technologist – Advanced Applications at Indium Corporation, will discuss his work on developing industry standards for sintering technologies used in electronics and power electronics at IMAPS Autumn Germany 2026 in Munich. The presentation titled "IEC Protocols: A Study on the Establishment of Standards for Sintering Technologies" will explore his role in a collaboration between the DKE working group and the International Electrotechnical Commission (IEC).
Indium Corporation's Senior Applications Development Engineer Ryan Mayberry will discuss formic acid soldering as a cutting‑edge alternative to traditional flux at PCB West, held September 29–October 2 in Santa Clara, California.
Indium Corporation's Senior Applications Development Engineer Ryan Mayberry will discuss how advanced metal thermal interface materials (TIMs) and liquid‑cooled cold plates work together to maximize heat removal, boosting AI/HPC application performance and efficiency, at the Open Computer Project Global Summit. The presentation, titled "Latest Advancements with Thermal Interface Materials", will present test data quantifying the performance impact from the silicon interface through the cooling loop to the data center.
Indium Corporation’s Andreas Karch will discuss how combining innovative solder materials with optimized reflow oven technology can reduce energy consumption at the Expo for Electronics Manufacturing in Stuttgart, Germany, October 6–8, 2026.
Indium Corporation announced it will showcase high-reliability solder pastes for PCB assembly and automotive applications at Expo for Electronics Manufacturing (EFX) 2026. Its Durafuse® HR alloy technology offers enhanced thermal-cycling performance and voiding control for high-reliability automotive applications.
Three Indium Corporation experts will share research and insights on advanced packaging and high-power performance challenges at the IMAPS Symposium 2026 in Boston, September 29–October 1. On September 30, Sze Pei Lim will present “Novel Interconnect Materials for Advanced Packaging Assembly Processes,” covering materials for advanced packaging and heterogeneous integration, including novel ultra-low residue flux.