Established as Sharp Takaya Electronics Industry Co., Ltd. through joint investment by Sharp Corporation and Takaya Co., Ltd. as a partner in Sharp's semiconductor business. Capital at establishment was 250 million yen.
Since its establishment in 1979, based on the spirit of the corporate motto and principles, we have mainly developed and manufactured LSI devices and module products, contributing to the sustainable development of society.
Start of IC and LSI package assembly & testing
Capital increased to 280 million yen
Start of wafer testing
2棟竣工
Start of TCP process production
Capital increased to 300 million yen
Start of COB process production
Start of chip production
3棟竣工
4棟竣工
RCJ認定、電子部品認証登録
Start of CCD process production
ISO9001登録
Start of CSP process production
Start of wafer backside polishing
COF生産開始
ISO14001登録
Capital increased to 310 million yen
5棟増設
Start of camera module production
Start of IC card production
Start of development technology center (formerly Yaka Factory) operations
Start of 1-Seg module production
Start of wafer-level CSP production
SAIGON STEC操業開始(100%子会社)
Start of camera unit production
Start of solar module production
ISO27001登録
Start of touch panel module assembly production
矢掛太陽光発電所運用開始
本社太陽光発電所運用開始
End of IC Card Production
ISO/TS16949登録
SAIGON STEC transferred 51% of shares to Sharp Corporation
Radar module production start
Sharp Corporation transferred all of its shares in our company to us
Change of capital to 100 million yen
Integrated the Development Technology Center (formerly: Yaka Factory) into the head office and returned it to Takaya Corporation
医療機器製造業登録
Changed the company name from Sharp Takaya Electronics Industry Co., Ltd. to Estakaya Electronics Industry Co., Ltd.
Establishment of ST Service Co., Ltd.
End of mold package (lead frame product) production
Certification of Kasaoka District Fire Department Rescue Mark certified business