| 会社名 | Group | 親会社 | 子会社 | 得意先 | 仕入先 | 業務提携 | 銀行等 | 株主等 |
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| TOYO Corporation | ||||||||
| Tescan Korea, Ltd. |
From Tesla to Tescan. Tescan was born in Brno, Czech Republic, where a legacy of electron optics was already part of the city’s DNA. Founded by former engineers from the Tesla factories (one of the world’s first leading electron microscope hubs), the mission was simple but ambitious. Build world‑class imaging systems that were easier to use and more accessible to the researchers who needed them most. Early innovations like PROXIMA (our integrated optical navigation system) and the VEGA variable pressure SEM set a tone we have kept ever since - practical, intuitive, and driven by real research needs.
The gate to east. Tescan is stepping into the Chinese market and establishing Tescan China.
The Merger. After two decades on parallel paths, Tescan and Orsay came together to form Tescan Orsay Holding. This was more than a merger; it was a meeting of minds. Tescan brought SEM systems known for their flexibility and ease of use, while Orsay contributed FIB expertise and precision engineering. Together, this team could offer integrated platforms across SEM, FIB-SEM, and microanalysis, united by a shared philosophy: make the complex feel simple.
Growing the Toolkit.
In 2022, Tescan achieved two major milestones that shaped its future direction. The launch of Tescan TENSOR™, the first 4D-STEM system developed from the ground up for a new level of performance and user experience, reinforced the company’s reputation for innovation in advanced analytical instrumentation.
Later that year, global investment firm Carlyle agreed to acquire a majority stake in Tescan, signaling strong confidence in the company’s technology, global position, and long-term growth potential.
In 2023, Tescan simplified its corporate structure by merging Tescan Orsay Holding, Tescan Brno, and two dormant entities into Tescan Group.
Tescan introduced a new generation of Tescan CLARA™ 2, designed to improve automation, usability, and time to data for demanding workflows in materials science and battery research.
Tescan TENSOR™ received an R&D 100 Award in the Analytical/Test category, marking Tescan’s second consecutive R&D 100 recognition after Tescan UniTOM® HR.
The company introduced Tescan AMBER™ 2 and Tescan AMBER X™ 2
Tescan also launched TEM AutoPrep Pro software
introduced ion beam integration
expanded its portfolio with Aura™ Gentle
strengthened its international presence with Tescan Korea
acquisition of EXpressLO LLC
introduction of Tescan FemtoChisel™
unveiled a new brand identity
acquisition of Tescan Korea and DML
Forty researchers and facility professionals from 24 institutions met in Brno, Czech Republic, on October 20–21, 2026. Hosted by CEITEC Nano and the University of Defence, the fourth annual Tescan Collaboration Network Meeting brought Tescan users together to share practical knowledge, discuss common challenges, and make new connections.
Tescan product marketing manager Tomas Boruvka explains the role of Tescan VEGA™ and why it continues to be used at Hyundai Materials Research Laboratory. VEGA, which has evolved for over 25 years, is designed for everyday material characterization, quality control, defect analysis, and research, integrating SEM imaging, elemental analysis, low‑vacuum capability, and easy sample navigation into a single analytical platform.
Tescan showcased its integrated workflows at ISTFA 2026, emphasizing advancements in semiconductor failure analysis. The conference served as a platform for professionals to exchange knowledge and discuss challenges posed by advanced packaging and increasingly complex devices. Tescan engaged with engineers, researchers, and industry experts to explore how integrated workflows can address these challenges.
In an interview, Tescan Product Marketing Manager Tomas Boruvka explains why the Tescan VEGA remains a practical choice for modern materials laboratories. He discusses the instrument’s enduring popularity, its fit for a range of applications, and when a proven SEM can be a smarter investment.
Tescan’s new EXLO Speed Challenge offers a streamlined workflow for TEM specimen preparation, reducing the learning curve associated with traditional FIB‑SEM techniques. The approach is designed to accelerate high‑throughput studies, such as statistical analyses and failure‑mode investigations, by simplifying specimen handling and minimizing setup time.
The article discusses the challenges of analyzing complex 3D semiconductor packages with buried regions. It highlights the use of Tescan FemtoChisel™ for correlative workflows to access and study these structures effectively.
Marek Dosbaba discussed Tescan’s automated mineralogy technology and its applications in geology and archaeology. He noted that identifying minerals can be time-consuming and that automation is useful, particularly when searching for rare accessory minerals.
Electron microscopy allows researchers to study biological structures at higher resolution than light microscopy. It enables detailed examination of cell and tissue surfaces, organelles, membranes, and molecular complexes.
Beer is generally made from water, malted grain, hops and yeast.
At SEMICON Taiwan 2026, Tescan presented an integrated failure analysis workflow designed to address advanced packaging, heterogeneous integration, and high‑bandwidth memory challenges. The workflow connects non‑destructive Micro‑CT inspection with gas‑assisted femtosecond laser processing, enabling correlative failure analysis across multiple scales.