| 1963年05月 |
Founded as Ome Electronics Kogyousho Co., Ltd. under the group umbrella of the Semiconductor Division of Hitachi, Ltd. |
| 1963年10月 |
Started manufacturing stems for germanium transistors |
| 1965年11月 |
Gained recognition for opening a canteen for our staff and received a letter of appreciation for our cooperation in the promotion of welfare from the Governor of Tokyo |
| 1969年08月 |
Changed company name to Hitachi Ome Electronics Kogyousho Co., Ltd. |
| 1973年11月 |
Started manufacturing power IC |
| 1977年06月 |
Inauguration of Precision Center as semiconductor device fabrication department |
| 1977年08月 |
Started manufacturing a new power IC product (new SIL) |
| 1978年02月 |
Changed company name to Hitachi Ome Denshi Co., Ltd. |
| 1979年04月 |
Started semiconductor fabrication equipment development, manufacturing, and servicing operations |
| 1979年11月 |
Started manufacturing high speed full automatic wire bonder (AUTAS) |
| 1981年08月 |
Opened Hamura Plant (in Ome, Tokyo) |
| 1985年04月 |
Changed company name to Hitachi Tokyo Electronics Co., Ltd. |
| 1985年12月 |
Ultra sensitive gas analyzer (Atmospheric pressure ionization mass spectrometer) won a "10 great new products" award presented by the Nikkan Kogyo Shimbun (The Daily Industrial News) in 1985. |
| 1989年04月 |
Started manufacturing Pellet Bonder PB Series |
| 1991年05月 |
Yamanashi Plant starts operation |
| 1991年05月 |
Started manufacturing high speed and high precision LOC mounter LM Series |
| 1991年05月 |
Started manufacturing die boner DB Series for general-purpose products |
| 1992年 |
Started manufacturing die bonder CM Series specially designed for DRAM |
| 1996年09月 |
Acquired ISO9001 certification |
| 1998年07月 |
Acquired ISO14001 certification |
| 1999年02月 |
Takasaki Equipment Department integrated into Yamanashi Plant |
| 2000年12月 |
Marketing of world’s first 300 mm compatible equipment (DB530) begins |
| 2002年 |
Eastern Japan Semiconductor Technologies, inc. established. Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd. |
| 2003年10月 |
Company name changed to Renesas Eastern Japan Semiconductor, inc. |
| 2004年03月 |
Marketing Department integrated into Yamanashi Plant |
| 2005年 |
Top market share for die bonders worldwide |
| 2010年04月 |
Equipment Division of Renesas Eastern Japan Semiconductor, inc. integrated into Hitachi High-Tech Instruments Co., Ltd. |
| 2010年12月 |
The Japanese government lauds research institutions and companies involved in the development of the Hayabusa spacecraft used for exploration of the asteroid Itokawa. Our equipment was integrated in the plant for analysis of the sample returned to earth and thereby contributed to the Hitachi Group receiving recognition. |
| 2011年 |
Won a CS Award presented by VLSI |
| 2015年03月 |
Bonding Equipment Division of Hitachi High-Tech Instruments Co., Ltd. split off to form Fasford Technology Co., Ltd. |
| 2015年04月 |
Fasford Technology Co., Ltd. established as independent company |
| 2016年10月 |
Started manufacturing high-speed high-performance automatic die bonder DD Series |
| 2017年11月 |
Won the grand prize in the category "Manufacturing" of Yamanashi Industry Awards |
| 2018年08月 |
Joined the corporate group of FUJI CORPORATION |
| 2019年11月 |
New office building completed |
| 2020年06月 |
The shipment quantity of the devices that support 300mm reached 5000 |
| 2021年12月 |
Warehouse building completed |
| 2023年12月 |
R&D (Research and Development) Building Completed |
