ファスフォードテクノロジ株式会社

Founded as Ome Electronics Kogyousho Co., Ltd. under the group umbrella of the Semiconductor Division of Hitachi, Ltd.

Started manufacturing stems for germanium transistors

ゲルマトランジスタ用ステム生産開始

Gained recognition for opening a canteen for our staff and received a letter of appreciation for our cooperation in the promotion of welfare from the Governor of Tokyo

社員食堂を開いたことが評価され、東京都知事より福祉増進協力感謝状受賞

Changed company name to Hitachi Ome Electronics Kogyousho Co., Ltd.

社名を株式会社日立青梅電子工業所に変更

Started manufacturing power IC

パワーIC生産開始

羽村工場設立(東京都羽村市)

Inauguration of Precision Center as semiconductor device fabrication department

半導体装置製作部門であるプレシジョンセンタ発足

Started manufacturing a new power IC product (new SIL)

Changed company name to Hitachi Ome Denshi Co., Ltd.

Started semiconductor fabrication equipment development, manufacturing, and servicing operations

Started manufacturing high speed full automatic wire bonder (AUTAS)

Opened Hamura Plant (in Ome, Tokyo)

Changed company name to Hitachi Tokyo Electronics Co., Ltd.

社名を日立東京エレクトロニクス株式会社に変更

Ultra sensitive gas analyzer (Atmospheric pressure ionization mass spectrometer) won a "10 great new products" award presented by the Nikkan Kogyo Shimbun (The Daily Industrial News) in 1985.

超高感度ガス分析装置（大気圧イオン化質量分析装置）が昭和60年度日刊工業新聞「10大新製品賞」を受賞

Started manufacturing Pellet Bonder PB Series

ペレットボンダPBシリーズ生産開始

Yamanashi Plant starts operation

Started manufacturing high speed and high precision LOC mounter LM Series

Started manufacturing die boner DB Series for general-purpose products

山梨工場操業開始

高速・高精度LOCマウンタLMシリーズ生産開始

汎用製品用ダイボンダDBシリーズ生産開始

Started manufacturing die bonder CM Series specially designed for DRAM

DRAM専用ダイボンダCMシリーズ生産開始

Acquired ISO9001 certification

Acquired ISO14001 certification

Takasaki Equipment Department integrated into Yamanashi Plant

Marketing of world’s first 300 mm compatible equipment (DB530) begins

Eastern Japan Semiconductor Technologies, inc. established. Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd.

Eastern Japan Semiconductor Technologies, inc. established Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd.

Company name changed to Renesas Eastern Japan Semiconductor, inc.

Marketing Department integrated into Yamanashi Plant

Top market share for die bonders worldwide

Equipment Division of Renesas Eastern Japan Semiconductor, inc. integrated into Hitachi High-Tech Instruments Co., Ltd.

The Japanese government lauds research institutions and companies involved in the development of the Hayabusa spacecraft used for exploration of the asteroid Itokawa. Our equipment was integrated in the plant for analysis of the sample returned to earth and thereby contributed to the Hitachi Group receiving recognition.

Won a CS Award presented by VLSI

Bonding Equipment Division of Hitachi High-Tech Instruments Co., Ltd. split off to form Fasford Technology Co., Ltd.

Fasford Technology Co., Ltd. established as independent company

Started manufacturing high-speed high-performance automatic die bonder DD Series

Won the grand prize in the category "Manufacturing" of Yamanashi Industry Awards

Joined the corporate group of FUJI CORPORATION

新しいオフィスビルが完成しました

The shipment quantity of the devices that support 300mm reached 5000

倉庫ビルが完成しました

The shipment quantity of the devices that support 300mm reached 6000

R&D（研究開発）ビルが完成しました

R&D　(Research and Development) Building Completed