DISCO HI-TEC (MALAYSIA) SDN. BHD.
Malaysia
Training Services
Precision Processing Equipment
Dicing Saws
Laser Saws
Grinders
Polishers
Wafer Mounter
Inspection Systems
Die Separator
Surface Planer
WaterJet Saw
Precision Processing Tools
Dicing Blades
Grinding Wheels
Dry Polishing Wheels
Accessory Equipment
Cut-Off Wheels
Blade Dicing Solutions
Laser Dicing Solutions
Grinding Solutions
Polishing Solutions
DBG/SDBG Solutions
After-Sales Service
Equipment Recycling Service
Troubleshooting
Customer Equipment Improvement
Technical Newsletters
Safety Data Sheets (SDS)
Inspection Sheet Search
Certificates and Parameter Sheets
Discontinued Equipment List
Products That Use CFCs
Training Centers (Japan, Korea, Taiwan, China)
Reworking by Third Party
Laser Oscillator Refurbishment by Third Parties
会社名
Group
親会社
子会社
得意先
仕入先
業務提携
銀行等
株主等
2026-08-31 03:08 (Model: gpt-oss-20b(16) )
