Applied Microengineering Ltd.

Applied Microengineering Ltd (AML) was founded by a group of talented and passionate engineers, initially involved in MEMS design and manufacture.

First Wafer Bonder - Bespoke anodic bonder - based on a scanning electron microscope chamber and manipulator was built for a European customer.

First Productionised Bonder - Based on the earlier anodic bonders, with improved functionality that set the physical template for subsequent bonders.

First Bonder for Commercial Production - First bonder that was supplied to a company for production rather than Research and Development.

Introducing Aligner Wafer Bonder AWB-04 - First AWB-04 “Aligner Wafer Bonder” - multifunctional system, not only for anodic bonding but also direct, thermocompression, eutectic, adhesive and glass frit. Suitable for bonding 4” & 6” wafers.

First AWB with 8-Inch Capability - AML developed and sold the first AWB-08 for bonding 6” & 8” wafers.

In-Situ Radical Activation - One of AML bonder's most valuable functions - RAD activation was introduced. In-situ surface activation for Low Temperature Direct Bonding became one of our major selling points.

Company Expansion - AML acquired additional buildings as part of a large-scale expansion. A new laboratory and a cleanroom were also commissioned at this time.

Further Business Development - This was a period of even more intensive R&D work on both bonding processes and machine improvements. More talented engineers joined AML's already dynamic R&D department.

Significant System Improvements - AML introduced many exciting machine improvements, including NIR cameras, Force Uniformity, Ultra High Vacuum and 40kN contact force.

New Management - AML's founders Rob Santilli and Tony Rogers retired and passed the company onto the existing and experienced team.

Celebrating 30 years! - In October AML celebrated 30 years as a trusted supplier of wafer bonding equipment.