Nihong Soldering (Shanghai) Co., Ltd.

1941 – Following government instructions, a joint association of industry peers in Tokyo, Osaka, Nagoya, and Hokkaido was formed, establishing the Japan Soldering Manufacturers Association.

1944 – Due to changes in the Commercial Association Act, the association and guild were dissolved, and Japan Soldering Industry Co., Ltd. was established.

1952 – Began production of Rapidsol (patented rosin-core solder).

1965 – Became a defense ministry-certified factory for MIL-standard solder and flux, the first of its kind in the domestic industry.

1966 – Became a licensed factory for all categories of solder and rosin-core solder under the JIS standard.

1977 – Built a new factory in Shibakawa City, Shimokita, and opened the current headquarters sales department. Began mass production and sales of degassed solder (vacuum degassed solder).

1983 – Constructed the second factory for degassed paste solder and began mass production and sales.

1989 – Company renamed to "Japan Soldering Co., Ltd."

1993 – Began development and sales of Dodent (conductive adhesive).

1995 – Developed vacuum degassed solder and received the Tanabe Inventor Award at the 20th Invention Award. Japan Innovation Promotion Association.

Established a joint venture, Japan Soldering Malaysia (factory/office), in Penang, Malaysia.

1996 – Awarded the Science and Technology Agency Director General Award for developing vacuum degassed solder.

2001 – Established a joint venture, Nihong Soldering (Shanghai) (factory/office), in Shanghai, China.

2004 – Certified under ISO14001: Environmental Management System. Japan Standards Association.

2005: Established Hong Kong office.

2007: Founded the Electronic Materials Research Institute at Niizaki Coast, Machida City.

2008: Certified under the new JIS standard for soldering.