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TOKYO SEIMITSU CO., LTD.

株式会社東京精密Tokyo Seimitsu Co., Ltd.AliasTOKYO SEIMITSU CO., LTDAlias
Ticker
Listed market
TYO
Country
Japan
Employees (consolidated)
2,890
Related companies
28
§01

Basic information

BASIC
Head office
〒192-8515 2968-2 Ishikawa-cho, Hachioji-shi, Tokyo, Japan
Chief executive
Ryuuichi Kimura
Capital
11,748,000,000  (117 100 million)
Employees (non-consolidated)
1,428 people
Employees (consolidated)
2,890 people
Start date
1949-03-28
End date
§02

Websites

2 DOMAINS
§03

Business

2
Semiconductor manufacturing equipmentPrecision measuring instruments
§04

Related companies

28 COMPANIES
Company name Group Parent Subsidiary Customer Supplier Alliance Bank Shareholder
Acreteck Powertronic System Co., Ltd.
Group Customer
Tose Systems Co., Ltd.
Group Customer
Tosei Engineering Co., Ltd.
Group Customer
Tosei Box Co., Ltd.
Group Customer
TOSEI (THAILAND) CO.,LTD.
Group
Accretech (Europe) Ltd.
Group
Accretech (Malaysia) Sdn. Bhd.
Group
Accretech (Singapore) Pte. Ltd.
Group
Accretech (Thailand) Co., Ltd.
Group
Accretech Adamas (Thailand) Co., Ltd.
Group
Accretech America Inc.
Group
Accretech Korea Co., Ltd.
Group
Accretech SBS, Inc.
Group
Accretech SBS UK Ltd.
Group
Accretech Taiwan Co., Ltd.
Group
Accretech Vietnam Co., Ltd.
Group
Accretech-Tosei Hungary Kft.
Group
Accretech-Tosei do Brasil Ltda.
Group
PT Accretech Indonesia
Group
PT TOSEI Indonesia.
Group
Tosei Engineering Pvt. Ltd.
Group
TOSEI Mexico, S.A. de C.V.
Group
TOSEI Philippines Corp.
Group
東精精密設備(上海)有限公司
Group
東精計量儀(平湖)有限公司
Group
Acuretec Create Co., Ltd.
Group
株式会社アクレーテク・ファイナンス
Group
東京精密工具株式会社
Names without a link are companies not yet registered in OpenBizGraph
§05

Network

NETWORK
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§06

History

133 EVENTS

Tokyo Seimitsu Kogu Co., Ltd. is established Appoints Kozo TOJIMA as chairman : Tokyo Seimitsu Co., Ltd.Sources

Tokyo Seimitsu Tools Co., Ltd. established, President Yoshikura TojimaSources

Tokyo Seimitsu Kogu Co., Ltd. was established, appointed Kozo Tojima as chairmanSources

Appoints Gonzo ISAHAYA as chairmanSources

Mr. Genzan Isasawa appointed as PresidentSources

Commences manufacture and sale of measuring machines using mechanical gaugesSources

Started manufacturing and sales of various measuring instruments using mechanical gaugesSources

Develops Japan's first flow type air micrometerSources

Succeeded in industrializing high-pressure flow type air micro-meter for the first time in JapanSources

Appoints Makoto TAKAGI as chairmanSources

Mr. Makoto Takaki appointed as PresidentSources

Develops Japan's first LVDT type electric micrometer Establishes Daiichi Seiki Co., Ltd.Sources

Succeeded in industrializing differential transformer type electric micro-meter for the first time in Japan, established First Seiki Co., Ltd.Sources

Develops Japan's first germanium pellet auto-sorterSources

Developed the world's first automatic sorting machine for germanium pelletsSources

Renames the Company as Tokyo Seimitsu Co., Ltd. : Stock is listed on the Tokyo Stock Exchange 2nd SectionSources

Renamed to Tokyo Seimitsu Co., Ltd., listed on the Second Section of the Tokyo Stock Exchange, developed surface roughness measuring instrumentSources

Renames the Company as Tokyo Seimitsu Co., Ltd. Stock is listed on the Tokyo Stock Exchange 2nd Section Develops surface texture measuring instrumentSources

Develops Japan's first wafer slicing machine Opens Hachioji PlantSources

Developed the first wafer slicing machine in JapanSources

Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to ChinaSources

Developed the first wafer probing machine in Japan, signed a plant technology export contract for electric and air micro-meters with ChinaSources

Develops cylindrical form measuring instrumentsSources

Development of a roundness measurement machineSources

Establishes Tosei Engineering Service Co., Ltd. (currently Tosei Engineering Corp.) : Opens Tsuchiura Plant : Develops Japan's first coordinate measuring machineSources

Establishment of Tosei Engineering Service Co., Ltd. (now Tosei Engineering Co., Ltd.), completion of the first phase of Tsuchiura Factory, and development of the first three-dimensional coordinate measuring machine in JapanSources

Establishes Tosei Engineering Service Co., Ltd. Opens Tsuchiura Plant Develops Japan's first coordinate measuring machineSources

Develops wafer dicing machineSources

Development of wafer dicing machinesSources

Appoints Akira MIURA as chairmanSources

Appointed Akira Miura as PresidentSources

Establishes Tosei Systems Co., Ltd. jointly with CEC as a software development groupSources

Founded Tosei Systems Co., Ltd., a software development specialist company, jointly with CEC Co., Ltd.Sources

Stock is listed on the Tokyo Stock Exchange 1st SectionSources

Reclassified to the First Section of the Tokyo Stock Exchange, appointed Goro Imazawa as PresidentSources

Stock is listed on the Tokyo Stock Exchange 1st Section Appoints Goro IMAZAWA as chairmanSources

Establishes Research LaboratorySources

Establishment of a technical research instituteSources

Appoints Shozaburo KARUBE as chairmanSources

Shōzōro Keibe appointed as PresidentSources

Establishes TOKYO SEIMITSU EUROPE GmbH (Germany) and TOKYO SEIMITSU AMERICA, INC. (USA)Sources

Established a local subsidiary in Germany, TOKYO SEIMITSU EUROPE GmbH, and in the United States, TOKYO SEIMITSU AMERICA, INC.Sources

Establishes TOKYO SEIMITSU EUROPE GmbH and TOKYO SEIMITSU AMERICA, INC.Sources

Appoints Hideo OHTSUBO as chairman : Acquires Silicon Technology Corporation (STC) of the United States : Establishes TSK Service Center in Korea : Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.Sources

Hideo Otsubo appointed as President, acquired Silicon Technology Corporation (STC) in the US, established a local subsidiary in Korea, TSK Service Center Co., Ltd., renamed to Tosei Engineering Co., Ltd. and Micro Technology Co., Ltd.Sources

Appoints Hideo OHTSUBO as chairman Acquires Silicon Technology Corporation (STC) of the United States Establishes TSK Service Center in Korea Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd.Sources

ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants : Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser" : Establishes Beijing Representative Office : Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.Sources

Obtained ISO 9001 certification at Hachioji and Tsuchiura factories, opened a representative office in Beijing, and established TOKYO SEIMITSU (MALAYSIA) SDN. BHD.Sources

ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the 'length measurement laser' Establishes Beijing Representative Office Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD.Sources

Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge" : Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China : Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States : Enters into partnership with Carl Zeiss in the field of high precision measuring instruments : Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machinesSources

Tsuchiura Factory was certified as a calibration provider for length measurement lasers under the Measurement Law Traceability System, established a joint venture with Zhongyuan Measuring Instrument Co., Ltd. in Sanmenxia, China, established TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the US, partnered with Carl Zeiss in Germany, and signed a sales license agreement for dicing machines with Kulick & Soffa Industries in the US.Sources

Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the 'block gauge' Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture with Zhongyuan Measuring Instrument Co., Ltd. of China Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the US Enters partnership with Carl Zeiss in high precision measuring instruments Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the US for sale of dicing machinesSources

Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.) : Establishes TSK Technical Center in Hsinchu, Taiwan : Establishes TOKYO SEIMITSU (ISRAEL) LTD.Sources

Received the 10 BEST Award in a customer satisfaction survey for semiconductor manufacturing equipment suppliers, opened a technical center in Hsinchu City, Taiwan, and established TOKYO SEIMITSU (ISRAEL) LTD.Sources

Receives '10 BEST Award' for customer satisfaction with semiconductor equipment supplier Establishes TSK Technical Center in Hsinchu, Taiwan Establishes TOKYO SEIMITSU (ISRAEL) LTD.Sources

Opens New Nagoya Plant of Tosei Engineering : Receives "10 BEST Award" for 2nd consecutive year : Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD. : Integrates U.S. subsidiaries into TSK AMERICA, INC.Sources

Completed a new factory in Nagoya for Tosei Engineering Co., Ltd., won the 10 BEST Award for two consecutive years, established TOKYO SEIMITSU (SINGAPORE) PTE. LTD., and integrated the US subsidiary into TSK AMERICA, INC.Sources

Opens New Nagoya Plant of Tosei Engineering Receives '10 BEST Award' for 2nd consecutive year Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD. Integrates U.S. subsidiaries into TSK AMERICA, INC.Sources

Hachioji and Tsuchiura plants obtain ISO 14001 certification : Receives "10 BEST Award" for 3rd consecutive yearSources

Obtained ISO 14001 certification at Hachioji and Tsuchiura factories, and won the 10 BEST Award for three consecutive years.Sources

Hachioji and Tsuchiura plants obtain ISO 14001 certification Receives '10 BEST Award' for 3rd consecutive yearSources

Inaugurates new head office of Tosei Engineering in Tsuchiura : Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. : Establishes TSK FINANCE CO., LTD. : Receives "10 BEST Award" for 4th consecutive year : Initiates business partnership for wire saws with HCT of Switzerland : Unveils New symbol mark at SEMICON JapanSources

Completed a new headquarters and factory in Tsuchiura for Tosei Engineering Co., Ltd., reorganized Micro Technology Co., Ltd. into a company supporting the development and sales of wafer surface inspection equipment, established TSK MICRO TECHNOLOGIES, Inc., and TSK FINANCE, Inc., won the 10 BEST Award for four consecutive years, and formed a business alliance with Swiss HCT for wire saws and related equipment, announced a new symbol mark at Semicon Japan '99.Sources

Inaugurates new head office of Tosei Engineering in Tsuchiura Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. Establishes TSK FINANCE CO., LTD. Receives '10 BEST Award' for 4th consecutive year Initiates partnership for wire saws with HCT of Switzerland Unveils new symbol mark at SEMICON JapanSources

Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel : Receives "10 BEST Award" for 5th consecutive year : Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp. : Develops wafer inspection system : Develops world's first polish grinderSources

Signed an exclusive sales agreement in Japan with Cognitec Systems of Israel for 3D vision systems, won the 10 BEST Award for five consecutive years, established Repler Co., Ltd. through joint investment with NanoRes of the US and Angel Lab, developed wafer surface inspection equipment, and developed the world's first polishing grinder.Sources

Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel Receives '10 BEST Award' for 5th consecutive year Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp. Develops wafer inspection system Develops world's first polish grinderSources

Introduces corporate brand "ACCRETECH" : Opens new Hachioji Main Plant Building : Receives "10 BEST Award" for 6th consecutive year : Establishes LEEPL Technology Consortium : Establishes TSK Box Corp. : Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD. : Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd SectionSources

Introduced the corporate brandSources

Introduces corporate brand 'ACCRETECH' Opens new Hachioji Main Plant Building Receives '10 BEST Award' for 6th consecutive year Establishes LEEPL Technology Consortium Establishes TSK Box Corp. Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD. Tosei Engineering stock listed on Tokyo Stock Exchange 2nd SectionSources

Introduces Executive Officer System and In-House Company System : Establishes ACCRETECH (CHINA) CO., LTD. : Renames subsidiaries as ACCRETECH : Develops next-generation wafer inspection systems : Jointly develops laser dicing equipment and CMPSources

Implemented an executive officer system and a company system, appointed Eiji Otsubo as Chairman (CEO), Sadakatsu Suzuki as President (COO), won the 10 BEST Award for seven consecutive years.Sources

Introduces Executive Officer System and In-House Company System in semiconductor, metrology, and administration divisions Establishes ACCRETECH (CHINA) CO., LTD. Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD. Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD. Renames TSK AMERICA, INC. as ACCRETECH USA, INC. Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD. Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD. Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD. Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD. Receives '10 Best Award' in two categories Develops next-generation wafer inspection systems jointly with Hitachi High Technologies Corp. Develops new laser dicing equipment with Hamamatsu Photonics K.K. Develops Chemical Mechanical Planarizer (CMP) Establishes local subsidiary in Shanghai, ChinaSources

Separates roles of Chairman & C.E.O. and President & C.O.O. : Appoints Hideo OHTSUBO as Chairman & C.E.O. : Appoints Sadakatsu SUZUKI as President & C.O.O. : Receives awards in testing and assembly equipment categories : Develops E-beam lithography systemSources

Separated the positions of Chairman (C.E.O.) and President (C.O.O.), Eiji Otsubo appointed Chairman C.E.O., Sadakatsu Suzuki appointed President C.O.O., received the 10 BEST Award in two divisionsSources

Separates roles of Chairman & C.E.O. and President & C.O.O. Appoints Hideo OHTSUBO as Chairman & C.E.O. Appoints Sadakatsu SUZUKI as President & C.O.O. Receives '10 BEST Award' in two categories Develops E-beam lithography systemSources

Receives "10 BEST Award" in two categories: Test & Material Handling Equipment (9th year), Assembly Equipment (3rd year)Sources

Received the 10 BEST Award in two divisions, awarded for 9 consecutive years in the testing, measurement, and inspection equipment division, and for 3 consecutive years in the assembly equipment divisionSources

Receives '10 BEST Award' in two categoriesSources

Completes new Semiconductor Plant in Hachioji and new Measuring Instrument Plant in Tsuchiura : Receives "10 BEST Award" in two categories : Sadakatsu SUZUKI becomes President & C.O.O. : Hideo OHTSUBO becomes Honorary Adviser of CSIA : Renewed partnership with Carl ZeissSources

Completion of the new semiconductor factory in Hachioji, completion of the new measurement factory in Tsuchiura, awarded the 10 BEST Award for 10 consecutive years, awarded in the assembly equipment division for 4 consecutive years, appointment of Sadakatsu Suzuki as President, CEO, and COO, Eizo Otsubo awarded the firstSources

Completes new semiconductor plant in Hachioji and new measuring instrument plant in Tsuchiura Receives '10 BEST Award' in two categories Sadakatsu SUZUKI becomes President & C.O.O. Hideo OHTSUBO becomes Honorary Adviser of the CSIASources

Receives "10 BEST Award" in two categories : Released "UF3000EX" wafer proberSources

Received the 10 BEST Award in two divisions, awarded for 11 consecutive years in the Material Conveyance Equipment division, 5 consecutive years in the Assembly Equipment division, launched sales of the 300mm Wafer Prober "UF3000EX"Sources

Receives '10 BEST Award' in two categories Releases 'UF3000EX' wafer proberSources

Establishment of Accretech Korea Co., Ltd. : MAHOH DICING MACHINE awarded Japan Machinery Federation Chairman's Award : Receives "10 BEST Awards" in two categories for 12 and 6 years respectively : Obtains business license at Tsuchiura Plant under Measurement LawSources

Established ACCRETECH Korea Co., Ltd., MAHOH DICING MACHINE received the Japan Machinery Federation President's Award for Excellent Energy-Saving Equipment, received the 10 BEST Award in two divisions, 12 consecutive years in the Material Conveyance Equipment division, 6 consecutive years in the Assembly Equipment division, Tsuchiura Factory obtained calibration certification for laser length measurement, separated CEO and COO, appointed Kazuo Fujimori COO, established a subsidiary in TaiwanSources

Establishes Accretech Korea Co., Ltd. MAHOH DICING MACHINE wins Japan Machinery Federation Chairman's Award Receives '10 BEST Awards' in two categories for 12 and 6 years consecutively Obtains business license at Tsuchiura Plant under Measurement Law Separates roles of C.E.O. & C.O.O. Kazuo FUJIMORI becomes C.O.O. Establishes ACCRETECH Taiwan Co., Ltd.Sources

Receives "10 BEST Awards" in two categories for 13 and 7 years : Technical cooperation with Mitaka Kohki Co., Ltd.Sources

Received the 10 BEST Award in two divisions, 13 consecutive years in the Testing, Measurement, and Inspection Equipment division, 7 consecutive years in the Assembly Equipment division, formed a technical partnership with Mitaka Kogaku for non-contact sensorsSources

Receives '10 BEST Awards' in two categories for 13 and 7 years consecutively Cooperates with Mitaka Kohki Co., Ltd. in non-contact metrologySources

Establishment of Tokyo Seimitsu USA Branch : Appointment of Mr. Kazuo FUJIMORI as CEOSources

Established Tokyo Seimitsu USA Branch, appointed Kazuo Fujimori as President and CEOSources

Establishes Tokyo Seimitsu USA Branch Kazuo FUJIMORI appointed CEOSources

Establishment of Tokyo Seimitsu USA BranchSources

Relocated headquarters to HachiojiSources

Appointment of Mr. Kunimasa OTA as CEO : Started mass-production of "AD3000T/S" : Establishment of Tokyo Seimitsu (Thailand) Co., Ltd. : New plant and local corporationSources

Appointed Kunimasa Ota as President and CEO, started mass production of the next-generation Dicing Machine "AD3000T/S", established Tokyo Seimitsu (Thailand) Co., Ltd., AD3000T/SSources

Kunimasa OTA appointed CEO Starts mass production of 'AD3000T/S' dicing machine Establishes Tokyo Seimitsu (Thailand) Co., Ltd. New Taiwan Application Center openedSources

Establishment of ACCRETECH Application Center : Acquisition of precision blade business from Mitsubishi Materials : Opened Tokyo Seimitsu Co., Ltd. Indonesia officeSources

Opened "ACCRETECH Application Center", acquired "Precision Blade Business" from Mitsubishi Materials, established Tokyo Seimitsu Co., Ltd. Indonesia Representative OfficeSources

Establishes ACCRETECH Application Center, acquires precision blade business from Mitsubishi Materials, opens representative office in IndonesiaSources

Establishment of ACCRETECH Vietnam Co. : Released non-contact sensor "Opt-measure"Sources

Established ACCRETECH Vietnam Co., Ltd., launched "Opt-measure" salesSources

Establishes ACCRETECH Vietnam Co., Ltd. Releases non-contact sensor 'Opt-measure'Sources

Appointment of Mr. Hitoshi YOSHIDA as CEO : Released "Opt-scope" : Establishment of PT. ACCRETECH Indonesia : Establishment of ACCRETECH ADAMAS (Thailand) Co., Ltd.Sources

President Hitoshi YOSHIDA assumes office, starts sales of "Opt-scope", establishes PT. ACCRETECH Indonesia, and establishes ACCRETECH ADAMAS (Thailand)Sources

Hitoshi YOSHIDA appointed CEO, releases surface roughness and contour measuring instrument "Opt-scope", establishes PT. ACCRETECH Indonesia and ACCRETECH ADAMAS (Thailand)Sources

Construction of new plant (No.6 Plant) in Hachioji completed : Tsuchiura plant obtained JIS Q 9100 certificationSources

Completed Semiconductor Hachioji Factory No. 6, obtained JISQ9100 certification at Tsuchiura Factory for measurementSources

Completes new plant (No.6 Plant) in Hachioji Tsuchiura plant obtains JIS Q 9100 certificationSources

Released high accuracy CNC coordinate measuring machine XYZAX AXCEL : Published ACCRETECH Declaration on Women's AdvancementSources

Collaborated with Panasonic on Laser Grooving Equipment, launched sales of "XYZAX AXCEL" and "SURFCOM TOUCH Series"Sources

Develops laser grooving devices with Panasonic Factory Solutions Co., Ltd. Publishes ACCRETECH Declaration on Women's Advancement Releases high-precision CNC coordinate measuring machine XYZAX AXCEL Releases SURFCOM TOUCH seriesSources

Released RONDCOM CREST and AltaProvSources

Launched sales of ultra-high precision roundness and cylindrical shape measuring instrument "RONDCOM CREST", launched "AltaProv"Sources

Releases RONDCOM CREST ultra-high precision roundness and cylindrical profile measuring instrument Releases AltaProv multi-stage prober for wafer measurementSources

Purchased majority shareholding in Fujitsu Telecom Networks Fukushima Limited : Tosei Engineering Corp. and Tosei America Inc. acquired balancer business from Schmitt Industries Inc.Sources

Acquired shares of Fujitsu Telecome Networks Fukushima, made it a subsidiary, and transferred the Balanser business to Tosei Engineering and its US subsidiarySources

Acquires majority share in Fujitsu Telecom Networks Fukushima Limited Becomes subsidiary Tosei Engineering Corp. and Tosei America Inc. acquire balancer business from Schmitt Industries Inc.Sources

Renovation of Osaka branch completed : Construction of new plant (MI Building) in Tsuchiura completedSources

New Osaka Sales Office established, Tsuchiura Factory MI Building completedSources

Completes renovation of Osaka branch and new plant (MI Building) in TsuchiuraSources

Construction of new building for Tokyo Seimitsu subsidiary ACCRETECH Taiwan Co., Ltd. completed : New Taiwan Application Center openedSources

Completed new building of ACCRETECH TAIWAN CO., LTD., established Taiwan Application CenterSources

Completes new building for Tokyo Seimitsu subsidiary ACCRETECH Taiwan Co., Ltd. Opens Taiwan Application CenterSources

Appointment of Mr. Hitoshi Yoshida as Chairman and CEO : Appointment of Mr. Ryuichi Kimura as President and COO : Moved to Prime Segment due to market classification revisionSources

Hitoshi Yoshida appointed as Chairman and CEO, Ryuichi Kimura appointed as President and COO, transitioned to the Tokyo Stock Exchange Prime MarketSources

Hitoshi Yoshida appointed Chairman and CEO Ryuichi Kimura appointed President and COO Company moves to Prime Segment due to market classification revisionSources

Construction of Hanno plant of Semiconductor Company completedSources

Completed the semiconductor Hannō FactorySources

Construction of Nagoya plant of Tosei Engineering completedSources

Completed the Nagoya Factory of Tosei EngineeringSources

§07

News

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§09

Sources & updates

SOURCES
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