| 1949 |
Tokyo Seimitsu Kogu Co., Ltd. is established Appoints Kozo TOJIMA as chairman : 東京精密工具(株) |
| 1949 |
東京精密工具（株）設立、東島好蔵社長 |
| 1949 |
Tokyo Seimitsu Kogu Co., Ltd. is established Appoints Kozo TOJIMA as chairman |
| 1950 |
Appoints Gonzo ISAHAYA as chairman |
| 1950 |
諫早艮三社長就任 |
| 1951 |
Commences manufacture and sale of measuring machines using mechanical gauges |
| 1951 |
メカニカルゲージを応用した各種測定器の製作販売開始 |
| 1952 |
Develops Japan's first flow type air micrometer |
| 1952 |
日本で初めて高圧流量式空気マイクロメータの工業化に成功 |
| 1955 |
Appoints Makoto TAKAGI as chairman |
| 1955 |
高城誠社長就任 |
| 1957 |
Develops Japan's first LVDT type electric micrometer Establishes Daiichi Seiki Co., Ltd. |
| 1957 |
日本で初めて差動変圧器式電気マイクロメータの工業化に成功、第一精機（株）設立 |
| 1958 |
Develops Japan's first germanium pellet auto-sorter |
| 1958 |
世界で初めてゲルマニウムペレット厚さ自動選別機を開発 |
| 1962 |
Renames the Company as Tokyo Seimitsu Co., Ltd. : Stock is listed on the Tokyo Stock Exchange 2nd Section |
| 1962 |
（株）東京精密に社名変更、東京証券取引所市場第二部に株式上場、表面粗さ測定機を開発 |
| 1962 |
Renames the Company as Tokyo Seimitsu Co., Ltd. Stock is listed on the Tokyo Stock Exchange 2nd Section Develops surface texture measuring instrument |
| 1963 |
Develops Japan's first wafer slicing machine Opens Hachioji Plant |
| 1963 |
日本で初めてウェーハスライシングマシンを開発 |
| 1964 |
Develops first wafer probing machine in Japan Commences sales of turn-key plant and production technology for electric and air micrometers to China |
| 1964 |
日本で初めてウェーハプロービングマシンを開発、中国と電気・空気マイクロメータのプラント技術輸出契約締結 |
| 1967 |
Develops cylindrical form measuring instruments |
| 1967 |
真円度測定機を開発 |
| 1969 |
Establishes Tosei Engineering Service Co., Ltd. (currently Tosei Engineering Corp.) : Opens Tsuchiura Plant : Develops Japan's first coordinate measuring machine |
| 1969 |
（株）東精エンジニアリングサービス（現（株）東精エンジニアリング）設立、土浦工場第一期工事完成、日本で初めて三次元座標測定機を開発 |
| 1969 |
Establishes Tosei Engineering Service Co., Ltd. Opens Tsuchiura Plant Develops Japan's first coordinate measuring machine |
| 1970 |
Develops wafer dicing machine |
| 1970 |
ウェーハダイシングマシンを開発 |
| 1980 |
Appoints Akira MIURA as chairman |
| 1980 |
三浦明社長就任 |
| 1985 |
Establishes Tosei Systems Co., Ltd. jointly with CEC as a software development group |
| 1985 |
ソフトウェア開発専門会社（株）トーセーシステムズを（株）シーイーシーと共同で設立 |
| 1986 |
Stock is listed on the Tokyo Stock Exchange 1st Section |
| 1986 |
東京証券取引所市場第一部に指定替え、今澤五郎社長就任 |
| 1986 |
Stock is listed on the Tokyo Stock Exchange 1st Section Appoints Goro IMAZAWA as chairman |
| 1987 |
Establishes Research Laboratory |
| 1987 |
技術研究所設立 |
| 1988 |
Appoints Shozaburo KARUBE as chairman |
| 1988 |
輕部昭三郎社長就任 |
| 1989 |
Establishes TOKYO SEIMITSU EUROPE GmbH (Germany) and TOKYO SEIMITSU AMERICA, INC. (USA) |
| 1989 |
ドイツに現地法人 TOKYO SEIMITSU EUROPE GmbH 設立、米国に現地法人 TOKYO SEIMITSU AMERICA, INC. 設立 |
| 1989 |
Establishes TOKYO SEIMITSU EUROPE GmbH and TOKYO SEIMITSU AMERICA, INC. |
| 1992 |
Appoints Hideo OHTSUBO as chairman : Acquires Silicon Technology Corporation (STC) of the United States : Establishes TSK Service Center in Korea : Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd. |
| 1992 |
大坪英夫社長就任、米国シリコン・テクノロジー（STC）社を買収、韓国に現地法人（株）TSKサービスセンター開設、（株）東精エンジニアリング、（株）マイクロテクノロジに社名変更 |
| 1992 |
Appoints Hideo OHTSUBO as chairman Acquires Silicon Technology Corporation (STC) of the United States Establishes TSK Service Center in Korea Renames Daiichi Seiki Co., Ltd. as Micro Technologies Co., Ltd. |
| 1994 |
ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants : Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the "length measurement laser" : Establishes Beijing Representative Office : Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD. |
| 1994 |
八王子・土浦両工場でISO9001の認証取得、北京駐在事務所開設、マレーシアに現地法人 TOKYO SEIMITSU （MALAYSIA） SDN. BHD. 設立 |
| 1994 |
ISO 9001 certification is awarded to the Hachioji and Tsuchiura Plants Hachioji Plant attains business license under the traceability system of the Measurement Law for the calibration of the 'length measurement laser' Establishes Beijing Representative Office Establishes TOKYO SEIMITSU (MALAYSIA) SDN. BHD. |
| 1995 |
Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the "block gauge" : Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture enterprise with Zhongyuan Measuring Instrument Co., Ltd. of China : Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the United States : Enters into partnership with Carl Zeiss in the field of high precision measuring instruments : Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the United States for the sale of dicing machines |
| 1995 |
土浦工場が計量法トレーサビリティ制度に基づく長さ測定用レーザの校正認定事業者として認定取得、中国三門峡中原量儀股扮有限公司と合弁会社設立、米国に現地法人 TSK AMERICA, INC. および TSK MANUFACTURING COMPANY 設立、ドイツのカールツァイス社と提携、米国のキューリック・アンド・ソファ・インダストリーズ社とダイシングマシン販売ライセンス契約 |
| 1995 |
Tsuchiura Plant attains business license under the traceability system of the Measurement Law for the calibration of the 'block gauge' Sets up Sanmenxia Zhongyuan Tokyo Seimitsu Co., Ltd. as a joint venture with Zhongyuan Measuring Instrument Co., Ltd. of China Establishes TSK AMERICA, INC. and TSK MANUFACTURING COMPANY in the US Enters partnership with Carl Zeiss in high precision measuring instruments Concludes licensing agreement with Kulicke and Soffa Industries, Inc. of the US for sale of dicing machines |
| 1996 |
Receives "10 BEST Award" for "Customer satisfaction with a semiconductor equipment supplier" (Survey by VLSI Research Inc.) : Establishes TSK Technical Center in Hsinchu, Taiwan : Establishes TOKYO SEIMITSU (ISRAEL) LTD. |
| 1996 |
半導体製造装置サプライヤー顧客満足度調査で10 BEST賞受賞、台湾新竹市にテクニカルセンター開設、TOKYO SEIMITSU（ISRAEL）LTD. 設立 |
| 1996 |
Receives '10 BEST Award' for customer satisfaction with semiconductor equipment supplier Establishes TSK Technical Center in Hsinchu, Taiwan Establishes TOKYO SEIMITSU (ISRAEL) LTD. |
| 1997 |
Opens New Nagoya Plant of Tosei Engineering : Receives "10 BEST Award" for 2nd consecutive year : Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD. : Integrates U.S. subsidiaries into TSK AMERICA, INC. |
| 1997 |
（株）東精エンジニアリング名古屋に新工場完成、10 BEST賞を2年連続受賞、TOKYO SEIMITSU （SINGAPORE） PTE. LTD. 設立、米国現地法人を TSK AMERICA, INC. に統合 |
| 1997 |
Opens New Nagoya Plant of Tosei Engineering Receives '10 BEST Award' for 2nd consecutive year Establishes TOKYO SEIMITSU (SINGAPORE) PTE. LTD. Integrates U.S. subsidiaries into TSK AMERICA, INC. |
| 1998 |
Hachioji and Tsuchiura plants obtain ISO 14001 certification : Receives "10 BEST Award" for 3rd consecutive year |
| 1998 |
八王子・土浦工場でISO 14001の認証取得、10 BEST賞を3年連続受賞 |
| 1998 |
Hachioji and Tsuchiura plants obtain ISO 14001 certification Receives '10 BEST Award' for 3rd consecutive year |
| 1999 |
Inaugurates new head office of Tosei Engineering in Tsuchiura : Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. : Establishes TSK FINANCE CO., LTD. : Receives "10 BEST Award" for 4th consecutive year : Initiates business partnership for wire saws with HCT of Switzerland : Unveils New symbol mark at SEMICON Japan |
| 1999 |
（株）東精エンジニアリング、土浦に新本社及び工場完成、（株）マイクロテクノロジをウェーハ外観検査装置の開発・販売サポート会社に組織変更、（株）ティーエスケイ・マイクロテクノロジ設立、（株）ティーエスケイ・ファイナンス設立、10 BEST賞を4年連続受賞、スイスHCT社とワイヤソー及び関連装置で業務提携、セミコンジャパン'99で新シンボルマーク発表 |
| 1999 |
Inaugurates new head office of Tosei Engineering in Tsuchiura Reorganizes MICRO TECHNOLOGIES CO., LTD. into TSK MICRO TECHNOLOGIES CO., LTD. Establishes TSK FINANCE CO., LTD. Receives '10 BEST Award' for 4th consecutive year Initiates partnership for wire saws with HCT of Switzerland Unveils new symbol mark at SEMICON Japan |
| 2000 |
Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel : Receives "10 BEST Award" for 5th consecutive year : Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp. : Develops wafer inspection system : Develops world's first polish grinder |
| 2000 |
イスラエルのコグニテンス社と3Dヴィジョンシステムの日本国内独占販売契約締結、10 BEST賞を5年連続受賞、米国ナノリソ社とエンジェルラボとの共同出資により（株）リープル設立、ウェハ外観検査装置開発、世界初のポリッシュグラインダ開発 |
| 2000 |
Signs sole Japanese dealership contract for 3D vision systems with CogniTens of Israel Receives '10 BEST Award' for 5th consecutive year Establishes LEEPL Corp. with U.S. company Nanolith, L.L.C. and ANGEL Labs Corp. Develops wafer inspection system Develops world's first polish grinder |
| 2001 |
Introduces corporate brand "ACCRETECH" : Opens new Hachioji Main Plant Building : Receives "10 BEST Award" for 6th consecutive year : Establishes LEEPL Technology Consortium : Establishes TSK Box Corp. : Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD. : Tosei Engineering Corporation stock is listed on the Tokyo Stock Exchange 2nd Section |
| 2001 |
コーポレートブランド「ACCRETECH」導入、八王子工場新本館完成、10 BEST賞を6年連続受賞、LEEPL技術コンソーシアム発足、（株）東精ボックス設立、TSK MICRO TECHNOLOGIES KOREA CO., LTD.設立、（株）東精エンジニアリング東京証券取引所市場第二部に株式上場 |
| 2001 |
Introduces corporate brand 'ACCRETECH' Opens new Hachioji Main Plant Building Receives '10 BEST Award' for 6th consecutive year Establishes LEEPL Technology Consortium Establishes TSK Box Corp. Establishes TSK MICRO TECHNOLOGIES KOREA CO., LTD. Tosei Engineering stock listed on Tokyo Stock Exchange 2nd Section |
| 2002 |
Introduces Executive Officer System and In-House Company System : Establishes ACCRETECH (CHINA) CO., LTD. : Renames subsidiaries as ACCRETECH : Develops next-generation wafer inspection systems : Jointly develops laser dicing equipment and CMP |
| 2002 |
執行役員制とカンパニー制導入、中国に現地法人東精精密設備（上海）有限公司設立、（株）ティーエスケイ・マイクロテクノロジを（株）アクレーテク・マイクロテクノロジに社名変更、TSK AMERICA, INC.をACCRETECH USA, INC.に社名変更、TOKYO SEIMITSU (MALAYSIA) SDN. BHD.をACCRETECH (MALAYSIA) SDN. BHD.に社名変更、TOKYO SEIMITSU (ISRAEL) LTD.をACCRETECH (ISRAEL) LTD.に社名変更、TOKYO SEIMITSU (SINGAPORE) PTE. LTD.をACCRETECH (SINGAPORE) PTE. LTD.に社名変更、TSK MICRO TECHNOLOGIES KOREA CO., LTD.をACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD.に社名変更、7年連続10 BEST賞受賞 |
| 2002 |
Introduces Executive Officer System and In-House Company System in semiconductor, metrology, and administration divisions Establishes ACCRETECH (CHINA) CO., LTD. Renames TSK MICRO TECHNOLOGIES CO., LTD. as ACCRETECH MICRO TECHNOLOGIES CO., LTD. Renames TSK FINANCE CO., LTD. as ACCRETECH FINANCE CO., LTD. Renames TSK AMERICA, INC. as ACCRETECH USA, INC. Renames TOKYO SEIMITSU (MALAYSIA) SDN. BHD. as ACCRETECH (MALAYSIA) SDN. BHD. Renames TOKYO SEIMITSU (ISRAEL) LTD. as ACCRETECH (ISRAEL) LTD. Renames TOKYO SEIMITSU (SINGAPORE) PTE. LTD. as ACCRETECH (SINGAPORE) PTE. LTD. Renames TSK MICRO TECHNOLOGIES KOREA CO., LTD. as ACCRETECH MICRO TECHNOLOGIES KOREA CO., LTD. Receives '10 Best Award' in two categories Develops next-generation wafer inspection systems jointly with Hitachi High Technologies Corp. Develops new laser dicing equipment with Hamamatsu Photonics K.K. Develops Chemical Mechanical Planarizer (CMP) Establishes local subsidiary in Shanghai, China |
| 2003 |
Separates roles of Chairman & C.E.O. and President & C.O.O. : Appoints Hideo OHTSUBO as Chairman & C.E.O. : Appoints Sadakatsu SUZUKI as President & C.O.O. : Receives awards in testing and assembly equipment categories : Develops E-beam lithography system |
| 2003 |
会長職（C.E.O.）と社長職（C.O.O.）を分離、大坪英夫会長C.E.O.就任、鈴木貞勝社長C.O.O.就任、2部門において10 BEST賞受賞 |
| 2003 |
Separates roles of Chairman & C.E.O. and President & C.O.O. Appoints Hideo OHTSUBO as Chairman & C.E.O. Appoints Sadakatsu SUZUKI as President & C.O.O. Receives '10 BEST Award' in two categories Develops E-beam lithography system |
| 2004 |
Receives "10 BEST Award" in two categories: Test & Material Handling Equipment (9th year), Assembly Equipment (3rd year) |
| 2004 |
2部門において10 BEST賞受賞、試験・計測・検査装置部門では9年連続受賞、組立装置部門では3年連続受賞 |
| 2004 |
Receives '10 BEST Award' in two categories |
| 2005 |
Completes new Semiconductor Plant in Hachioji and new Measuring Instrument Plant in Tsuchiura : Receives "10 BEST Award" in two categories : Sadakatsu SUZUKI becomes President & C.O.O. : Hideo OHTSUBO becomes Honorary Adviser of CSIA : Renewed partnership with Carl Zeiss |
| 2005 |
半導体八王子新工場完成、計測土浦新工場完成、10 BEST賞を10年連続受賞、組立装置部門で4年連続受賞、鈴木貞勝社長CEO兼COO就任、大坪英夫会長が中国半導体産業協会から初の「名誉顧問」授与、ドイツのカールツァイス社と提携更新 |
| 2005 |
Completes new semiconductor plant in Hachioji and new measuring instrument plant in Tsuchiura Receives '10 BEST Award' in two categories Sadakatsu SUZUKI becomes President & C.O.O. Hideo OHTSUBO becomes Honorary Adviser of the CSIA |
| 2006 |
Receives "10 BEST Award" in two categories : Released "UF3000EX" wafer prober |
| 2006 |
2部門において10 BEST賞受賞、材料搬送装置部門で11年連続受賞、組立装置部門で5年連続受賞、300mmウェーハプローバ「UF3000EX」販売開始 |
| 2006 |
Receives '10 BEST Award' in two categories Releases 'UF3000EX' wafer prober |
| 2007 |
Establishment of Accretech Korea Co., Ltd. : MAHOH DICING MACHINE awarded Japan Machinery Federation Chairman's Award : Receives "10 BEST Awards" in two categories for 12 and 6 years respectively : Obtains business license at Tsuchiura Plant under Measurement Law |
| 2007 |
ACCRETECH Korea Co., Ltd.設立、MAHOH DICING MACHINEが優秀省エネルギー機器表彰で日本機械工業連合会会長賞受賞、2部門において10 BEST賞受賞、材料搬送装置部門で12年連続、組立装置部門で6年連続受賞、土浦工場が長さ測定用レーザの校正認定取得、CEOとCOOを分離、藤森一雄COO就任、台湾法人設立 |
| 2007 |
Establishes Accretech Korea Co., Ltd. MAHOH DICING MACHINE wins Japan Machinery Federation Chairman's Award Receives '10 BEST Awards' in two categories for 12 and 6 years consecutively Obtains business license at Tsuchiura Plant under Measurement Law Separates roles of C.E.O. & C.O.O. Kazuo FUJIMORI becomes C.O.O. Establishes ACCRETECH Taiwan Co., Ltd. |
| 2008 |
Receives "10 BEST Awards" in two categories for 13 and 7 years : Technical cooperation with Mitaka Kohki Co., Ltd. |
| 2008 |
2部門において10 BEST賞受賞、試験・計測・検査装置部門で13年連続受賞、組立装置部門で7年連続受賞、非接触センサで三鷹光器と技術提携 |
| 2008 |
Receives '10 BEST Awards' in two categories for 13 and 7 years consecutively Cooperates with Mitaka Kohki Co., Ltd. in non-contact metrology |
| 2009 |
Establishment of Tokyo Seimitsu USA Branch : Appointment of Mr. Kazuo FUJIMORI as CEO |
| 2009 |
東京精密 USA支店設立、藤森一雄社長CEO就任 |
| 2009 |
Establishes Tokyo Seimitsu USA Branch Kazuo FUJIMORI appointed CEO |
| 2010 |
Establishment of Tokyo Seimitsu USA Branch |
| 2010 |
本社を八王子に移転 |
| 2011 |
Appointment of Mr. Kunimasa OTA as CEO : Started mass-production of "AD3000T/S" : Establishment of Tokyo Seimitsu (Thailand) Co., Ltd. : New plant and local corporation |
| 2011 |
太田邦正社長CEO就任、次世代ダイシングマシン「AD3000T/S」量産稼動開始、Tokyo Seimitsu（Thailand）Co., Ltd.設立、AD3000T/S |
| 2011 |
Kunimasa OTA appointed CEO Starts mass production of 'AD3000T/S' dicing machine Establishes Tokyo Seimitsu (Thailand) Co., Ltd. New Taiwan Application Center opened |
| 2012 |
Establishment of ACCRETECH Application Center : Acquisition of precision blade business from Mitsubishi Materials : Opened Tokyo Seimitsu Co., Ltd. Indonesia office |
| 2012 |
「ACCRETECH Application Center」開設、三菱マテリアルから「精密ブレード事業譲受」、Tokyo Seimitsu Co., Ltd. Indonesia駐在員事務所開設 |
| 2012 |
Establishes ACCRETECH Application Center Acquires precision blade business from Mitsubishi Materials Opens representative office in Indonesia |
| 2013 |
Establishment of ACCRETECH Vietnam Co. : Released non-contact sensor "Opt-measure" |
| 2013 |
ACCRETECH Vietnam Co., Ltd.設立、「Opt-measure」販売開始 |
| 2013 |
Establishes ACCRETECH Vietnam Co., Ltd. Releases non-contact sensor 'Opt-measure' |
| 2015 |
Appointment of Mr. Hitoshi YOSHIDA as CEO : Released "Opt-scope" : Establishment of PT. ACCRETECH Indonesia : Establishment of ACCRETECH ADAMAS (Thailand) Co., Ltd. |
| 2015 |
吉田均社長CEO就任、「Opt-scope」販売開始、PT. ACCRETECH Indonesia設立、ACCRETECH ADAMAS（Thailand）設立 |
| 2015 |
Hitoshi YOSHIDA appointed CEO Releases 'Opt-scope' surface roughness and contour measuring instrument Establishes PT. ACCRETECH Indonesia and ACCRETECH ADAMAS (Thailand) |
| 2016 |
Construction of new plant (No.6 Plant) in Hachioji completed : Tsuchiura plant obtained JIS Q 9100 certification |
| 2016 |
半導体八王子第6工場竣工、計測土浦工場でJISQ9100認証取得 |
| 2016 |
Completes new plant (No.6 Plant) in Hachioji Tsuchiura plant obtains JIS Q 9100 certification |
| 2017 |
Released high accuracy CNC coordinate measuring machine XYZAX AXCEL : Published ACCRETECH Declaration on Women's Advancement |
| 2017 |
レーザーグルービング装置でパナソニックと協業、「XYZAX AXCEL」販売開始、「SURFCOM TOUCHシリーズ」販売開始 |
| 2017 |
Develops laser grooving devices with Panasonic Factory Solutions Co., Ltd. Publishes ACCRETECH Declaration on Women's Advancement Releases high-precision CNC coordinate measuring machine XYZAX AXCEL Releases SURFCOM TOUCH series |
| 2018 |
Released RONDCOM CREST and AltaProv |
| 2018 |
超高精度真円度・円筒形状測定機「RONDCOM CREST」販売開始、「AltaProv」販売開始 |
| 2018 |
Releases RONDCOM CREST ultra-high precision roundness and cylindrical profile measuring instrument Releases AltaProv multi-stage prober for wafer measurement |
| 2019 |
Purchased majority shareholding in Fujitsu Telecom Networks Fukushima Limited : Tosei Engineering Corp. and Tosei America Inc. acquired balancer business from Schmitt Industries Inc. |
| 2019 |
富士通テレコムネットワークス福島の株式取得・子会社化、東精エンジニアリングと米国子会社がバランサ事業譲受 |
| 2019 |
Acquires majority share in Fujitsu Telecom Networks Fukushima Limited Becomes subsidiary Tosei Engineering Corp. and Tosei America Inc. acquire balancer business from Schmitt Industries Inc. |
| 2020 |
Renovation of Osaka branch completed : Construction of new plant (MI Building) in Tsuchiura completed |
| 2020 |
大阪営業所新設、土浦工場MI棟竣工 |
| 2020 |
Completes renovation of Osaka branch and new plant (MI Building) in Tsuchiura |
| 2021 |
Construction of new building for Tokyo Seimitsu subsidiary ACCRETECH Taiwan Co., Ltd. completed : New Taiwan Application Center opened |
| 2021 |
ACCRETECH TAIWAN CO., LTD.新社屋完成、台湾アプリケーションセンタ設立 |
| 2021 |
Completes new building for Tokyo Seimitsu subsidiary ACCRETECH Taiwan Co., Ltd. Opens Taiwan Application Center |
| 2022 |
Appointment of Mr. Hitoshi Yoshida as Chairman and CEO : Appointment of Mr. Ryuichi Kimura as President and COO : Moved to Prime Segment due to market classification revision |
| 2022 |
吉田均会長CEO就任、木村龍一社長COO就任、東京証券取引所プライム市場へ移行 |
| 2022 |
Hitoshi Yoshida appointed Chairman and CEO Ryuichi Kimura appointed President and COO Company moves to Prime Segment due to market classification revision |
| 2023 |
Construction of Hanno plant of Semiconductor Company completed |
| 2023 |
半導体飯能工場竣工 |
| 2025 |
Construction of Nagoya plant of Tosei Engineering completed |
| 2025 |
東精エンジニアリング名古屋工場竣工 |
