Development, manufacturing, and sales of adhesive materials, adhesive-related equipment, special paper, release paper, and release filmAdhesive paper and adhesive film for printingLabel materials for variable information printingDigital label printersDouble-sided and packaging tapesIndustrial adhesive tapesPackaging tapesWindow film for buildingsWindow film for automobilesAdhesive products for automobilesMaterials for signs, advertising, and decorationSemiconductor-related tapesSemiconductor-related equipmentTapes related to multilayer ceramic capacitorsOptical functional filmsTouch panel related productsFilms for LCD displaysEquipment and devicesLabeling machinesBarcode printersSpecial paperEnvelope paperFancy paperPremium printing paperInkjet paperSpecial function paperRelease paper & release filmAntibacterial & mold inhibitorInsect repellent goodsSticky notes & Post-it
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Network
NETWORK
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History
175 EVENTS
Shiohaku Yuu founded "Fuji Shokai" in Sumida, Tokyo, and began manufacturing gum tape.
Shiohaku Kiyoshi founded Fuji Shokai in Suginami, Tokyo, and started manufacturing gum tape.
Shiohaku Keiyu founded Fuji Shokai in Sumida, Tokyo. Began manufacturing and selling packaging gum tape.
Started manufacturing packaging gum tape.
Keisuke Shiwaku established FUJI SHOKAI in Sugamo, Tokyo.
Reorganized Fuji Shokai and established Fuji Gomen Company. Moved headquarters and main factory to Itabashi, Tokyo.
Keisuke Shiwaku established FUJI SHOKAI in Sugamo, Tokyo
Founded in 1934, the predecessor of our company, Fuji Paper Co., Ltd., began mass production of cardboard packaging tape in Japan for the first time.
Relocated headquarters and main factory to Itabashi, Tokyo.
The company relocated to Itabashi and officially began operations as Fuji Paper Co., Ltd.
Reorganized Fuji Gomen Company and established Fuji Shiko Co., Ltd.
Reorganized Fuji Gomei Kaisha and established Fuji Shiko Corporation
Our predecessor, FUJI SHIKO CORPORATION, was established in 1934. This company was the first in Japan to commercially mass-produce gummed tape for sealing cardboard boxes, and this tape is the origin of our adhesive technologies.
1934年10月15日 October 15, 1934
Reorganized Fuji Gomen Company and established Fuji Paper Co., Ltd.
Established Fuji Gōmei Kaisha.
Started manufacturing and selling plywood gum tape.
Commenced manufacturing and sales of plywood gum tape.
Started manufacturing and selling plywood gum tape.
Started manufacturing and selling seal and label gum tape (printing gum paper).
Opened Osaka sales office.
Opened an Osaka sales office.
Open Osaka sales office. From this year, begin full nationwide sales expansion and establishment of facilities.
Initiated nationwide sales expansion and establishment of facilities.
Established a laboratory at the Itabashi headquarters and began serious technology and product development.
Established a laboratory at the Itabashi headquarters and began serious technology and product development.
Establish Wako factory (Saitama Prefecture) and establish mass production system for gum tape.
Established a new factory in Wako (Saitama Prefecture) and established a mass production system for gum tape.
Opened a new factory in Warabi (Saitama Prefecture) and established a mass production system for gum tape.
Started production and sales of adhesive paper for seals and labels, and later began production and sales of adhesive film.
Start manufacturing and selling printing adhesive paper. Later also start manufacturing and selling adhesive film.
Started production and sales of adhesive paper for seals and labels, later commenced production and sales of adhesive film
Commenced manufacturing and sales of printing adhesive paper.
Started manufacturing and selling printing adhesive paper, later expanding into adhesive film production and sales.
Set up automatic packaging machine manufacturing division and start system sales combined with packaging gum tape.
Established an automatic packaging machine manufacturing division and launched system sales combined with packaging gum tape.
Established an automatic packaging machine manufacturing division and began system sales combining packaging gum tape.
Separate the automatic packaging machine manufacturing division, establish FBS Paper Machinery Division, Inc. (later renamed to FSK Engineering Co., Ltd.).
Separated the automatic packaging machine manufacturing division and established the FBS Machinery Division of Fuji Paper & Machinery Co., Ltd. (later renamed to FSK Engineering Co., Ltd.).
Separated the automatic packaging machine division and established Fuji Paper Machinery Division, Inc. (later renamed FSK Engineering Co., Ltd.).
Move laboratory to Wako factory. Begin new product development utilizing proprietary technology.
Moved the laboratory to the Warabi factory and began developing new products utilizing proprietary technology.
Moved the laboratory to the Warabi factory and began developing new products using proprietary technology.
Establish Kansai factory (Hyogo Prefecture, current Ryuo factory) as a product supply base in western Japan.
Started developing new applications for adhesive materials such as building window film and marking film.
Developed building wind films, marking films, and UV-curable die-cutting tapes.
Started manufacturing and selling labeling machines.
Started production and sales of labeling machines.
Started production and sales of labeling machines
Commenced manufacturing and sales of labeling machines.
Established a new Kanto factory (Gunma Prefecture – current Azusa factory) as a product supply base for Eastern Japan.
Established a new Kanto factory (Gunma Prefecture, current Azusa factory).
Established a new Kanto factory in Gunma Prefecture.
Renamed to FSK Co., Ltd.
Company name was changed to FSK CORPORATION.
Company name was changed to FSK CORPORATION
Developed UV-curable dicing tape and made full-scale entry into the semiconductor-related product field
Renamed the company to FSK Co., Ltd.
Developed UV-curable die-cutting tape and entered the semiconductor-related field.
Listed on the Second Section of the Tokyo Stock Exchange.
Listed on the Second Section of the Tokyo Stock Exchange.
Develop UV-curable dicing tape and fully enter the semiconductor-related business.
Listed on the Second Section of the Tokyo Stock Exchange
Established a new Kanto factory in Gunma Prefecture.
Established PT. LINTEC INDONESIA
Developed UV-curable die-cutting tape and fully entered the semiconductor-related business.
Listed on the Second Section of the Tokyo Stock Exchange.
Developed UV-curable dicing tape and fully entered the semiconductor-related product field.
Establish FSK OF AMERICA, INC. (now LINTEC USA HOLDING, INC.) and acquire local wind film manufacturer MADICO, INC. as a subsidiary.
Acquired MADICO, INC., a U.S. company, as a subsidiary
Merger with FSK Engineering Co., Ltd.
Merged with FSK Engineering Co., Ltd.
Merged with FSK Engineering Co., Ltd.
Designated as a First Section listing on the Tokyo Stock Exchange
Started anew as Lintec following the merger of three companies in 1990
Merged with two other companies, giving birth to LINTEC of today, and greatly expanded the range of technologies into upstream fields such as specialty paper production.
Merged with Shikoku Paper Co., Ltd. and Soken Chemical Co., Ltd., and started as LinTech Co., Ltd.
Established PT. LINTEC INDONESIA.
Merged with Shikoku Paper Co., Ltd. and Seiken Chemical Co., Ltd., and started as LinTech Co., Ltd.
Merged with Shikoku Paper Co., Ltd. and Soken Chemical Co., Ltd., and renamed the company to LinTech Co., Ltd.
Entered the optical display field, including LCD
Established the U.S. R&D base LINTEC RESEARCH BOSTON, INC.
Fully entered the optical display-related business.
Established LINTEC RESEARCH BOSTON, INC.
Opened a Singapore office
Established PT. LINTEC INDONESIA.
Established PT. LINTEC INDONESIA
Established LINTEC SINGAPORE PRIVATE LIMITED and LINTEC EUROPE B.V.
Established LINTEC SINGAPORE PRIVATE LIMITED
Established LINTEC EUROPE B.V.
Constructed a new research building in Saitama Prefecture.
Constructed a new research building
Merged with MODERN PLASTIC INDUSTRIES CO., LTD.
Merged with MODERN PLASTIC INDUSTRIES CO., LTD.
Acquired and merged Modern Plastics Co., Ltd. as a subsidiary.
Merged with Modern Plastics Industrial Co., Ltd.
Established a new manufacturing site for optical products at Shingu Office in Hyogo Prefecture.
Established a new manufacturing site for optical products at Shinguu
Established LINTEC INDUSTRIES (SARAWAK) SDN. BHD.
Established LINTEC INDUSTRIES (SARAWAK) SDN. BHD.
Established an electronics component subsidiary in Malaysia
Established LINTEC INDUSTRIES (MALAYSIA) SDN. BHD.
Established LINTEC ADVANCED TECHNOLOGIES (USA), INC.
Established LINTEC SPECIALITY FILMS (KOREA), INC.
Established LINTEC (SUZHOU) TECH CORPORATION.
Established LINTEC (SUZHOU) TECH CORPORATION
Established PrintTech Co., Ltd.
Established LINTEC ADVANCED TECHNOLOGIES (EUROPE) GMBH
Established LINTEC ADVANCED TECHNOLOGIES (SHANGHAI), INC.
Established LINTEC KOREA, INC.
Established LINTEC KOREA, INC.
Established LINTEC KOREA, INC.
Established LINTEC BKK PTE LIMITED (Thailand)
Established LinTech Customer Service Co., Ltd.
Established LINTEC PHILIPPINES (PEZA), INC.
LINTEC ADVANCED TECHNOLOGIES (EUROPE) GMBH opens an Israel office
LINTEC SINGAPORE PRIVATE LIMITED opens a Delhi office
LINTEC SINGAPORE PRIVATE LIMITED opens a Ho Chi Minh office
Sekisui Sign System Co., Ltd. (now Lintec Sign System Co., Ltd.) is made a subsidiary
LINTEC ADVANCED TECHNOLOGIES (USA), INC. and LINTEC RESEARCH BOSTON, INC. merge to form LINTEC OF AMERICA, INC.
Ho Chi Minh office is incorporated locally as LINTEC VIETNAM CO., LTD.
MACTAC AMERICAS, LLC becomes a subsidiary
Reconstruction work at the Ryuno factory completed
Reconstruction work at Ryuo factory is completed
Established LINTEC (THAILAND) CO., LTD.
Established LINTEC (THAILAND) CO., LTD.
LINTEC (THAILAND) CO., LTD. is established
Established LINTEC (THAILAND) CO., LTD. as a local manufacturing base
LINTEC HANOI VIETNAM CO., LTD. is established
Established LINTEC INDIA PRIVATE LIMITED.
Established LINTEC INDIA PRIVATE LIMITED
PT. LINTEC JAKARTA is established
Established LINTEC HANOI VIETNAM CO., LTD.
Opened Nano-Science & Technology Center.
Established Nano-Science & Technology Center
LINTEC OF AMERICA, INC. opens a Nano Science & Technology Center
LINTEC KUALA LUMPUR SDN. BHD. is established
Established LINTEC ASIA PACIFIC REGIONAL HEADQUARTERS PRIVATE LIMITED.
Established LINTEC KUALA LUMPUR SDN. BHD. (Malaysia)
Established LINTEC ASIA PACIFIC REGIONAL HEADQUARTERS PRIVATE LIMITED
LINTEC ASIA PACIFIC REGIONAL HEADQUARTERS PRIVATE LIMITED is established
Advanced technology building is constructed at the research institute
Lintec Co., Ltd. opens a Hanoi office
Became a subsidiary of VDI, LLC in the United States.
Reorganized the Hanoi office of LINTEC SINGAPORE PRIVATE LIMITED (Vietnam) and opened LINTEC Corporation Hanoi office
VDI, LLC became a subsidiary in the United States
VDI, LLC becomes a subsidiary
Became a subsidiary of LINTEC GRAPHIC FILMS LIMITED in the United Kingdom.
LINTEC GRAPHIC FILMS LIMITED became a subsidiary in the United Kingdom
LINTEC GRAPHIC FILMS LIMITED becomes a subsidiary
Became a subsidiary of MACTAC AMERICAS, LLC in the United States.
MACTAC AMERICAS, LLC became a subsidiary in the United States
MACTAC AMERICAS, LLC becomes a subsidiary
Acquired MACTAC AMERICAS, LLC, a U.S. manufacturer of adhesive paper and film, as a subsidiary
LINTEC BKK PTE LIMITED is merged into LINTEC (THAILAND) CO., LTD.
Established Shonan Linttec Processing Co., Ltd.
Established Shonan Lintec Processing Co., Ltd. through a group company reorganization
Relocated the sales headquarters and opened the Bunkyo Kasuga office.
Became a subsidiary of DURAMARK PRODUCTS, INC. in the United States.
DURAMARK PRODUCTS, INC. became a subsidiary in the United States
Acquired Duramark Products, Inc., an American adhesive product manufacturer (absorbed into the MackTack Group at the end of December 2021).
Acquired Duramark Products, Inc. as a subsidiary (absorbed into the Macktack Group in December 2021).
Merged with a subsidiary of MACTAC AMERICAS, LLC.
Merged with a subsidiary of MACTAC AMERICAS, LLC, in December 2021
Founded Spinnaker Pressure Sensitive Products LLC (absorbed into the Macktack Group in December 2023).
Established SPINNAKER PRESSURE SENSITIVE PRODUCTS LLC by carrying out a business transfer for the manufacturer of adhesive paper and film for labels in the United States.
Acquired Duramark Products, Inc., a U.S. adhesive product manufacturer, as a subsidiary (absorbed into the MacTack Group in December 2021)
Established SPINNAKER PRESSURE SENSITIVE PRODUCTS LLC by carrying out a business transfer for the manufacturer of adhesive paper and film for labels in the United States
Acquired a business from an American label adhesive paper and film manufacturer and established Spinnaker Pressure Sensitive Products LLC.
Transitioned to the Prime Market following the reorganization of the Tokyo Stock Exchange
Acquired the business of Label Supply, a Canadian company specializing in cutting and selling label adhesive products.
Transitioned to the Prime Market following the reorganization of the Tokyo Stock Exchange.
Transitioned to the Prime market following the reorganization of market segments at the Tokyo Stock Exchange.
Acquired the business of LABEL SUPPLY, a Canadian company that slits and sells adhesive products for labels.
Merged with a subsidiary of MACTAC AMERICAS, LLC, in December 2023
§07
News
415 ARTICLES
Add matte anti-theft film that blocks external views
Lintec Co., Ltd. has added a matte type to its lineup of anti-theft films for window glass. The new product "1361UH" uses a 350 µm thick multi-layer film, offering high penetration resistance and, when applied to the entire window glass, delays intrusion. It also contributes to privacy protection and is proposed for residential homes and stores.
Rintell Indonesia Secures Halal Certification
Rintell Indonesia has obtained Halal certification from the Indonesian Halal Product Assurance Agency (BPJPH) for all of its adhesive papers, adhesive films, and release papers manufactured. The certification applies to the company's products and packaging as the requirement for medium and large-scale enterprises becomes mandatory from October 2024.
Notice Regarding Interim Dividend
Lintec Corporation decided on the interim dividend for the 133rd term (April 1, 2026 – March 31, 2027) at a board meeting held on November 9, 2026. The dividend of 90 yen per share will be paid from November 27, 2026, and dividend receipts will be sent to shareholders on November 26.
Rintell Co., Ltd. Revision of Full-Year Consolidated Earnings Forecast and Dividend Forecast
Rintell Co., Ltd. revised its full-year consolidated earnings forecast on November 9, 2026, raising revenue from 342,000 million yen to 358,000 million yen and operating profit from 27,500 million yen to 38,000 million yen. Additionally, net income attributable to parent company shareholders increased from 19,500 million yen to 27,500 million yen, and earnings per share rose from 297.79 yen to 442.93 yen.
Awarded the Tokyo Governor's Award at the Kanto Regional Innovation Awards
Lintec received the Tokyo Governor's Award and the Innovation Encouragement Award at the 2026 Kanto Regional Innovation Awards. Patents for a special adhesive tape for semiconductors earned the Tokyo Governor's Award, while patents for an LED mounting material earned the Innovation Encouragement Award. Both technologies are incorporated into Lintec's semiconductor and electronic component products.
Notice of Unauthorized Access to Some Systems of Our Group
Lintec announced today that unauthorized access by a third party was confirmed on some systems of our group. We are investigating the intrusion path, scope of impact, and whether any information was leaked in cooperation with external experts. We will promptly disclose the results as soon as they become known. We also expressed apologies to those affected.
LINTEC Publishes Its 2026 Integrated Report
LINTEC Corporation has published its Integrated Report 2026. It presents the company's initiatives for sustainable growth and realizing a sustainable society, along with its path to creating value. LINTEC also produced a digest video to reach new audiences.
Lintec Builds New Facility at Ina Technology Center
Lintec has invested approximately ¥2.5 billion to build a new facility at its Ina Technology Center in response to growing demand for semiconductor-related equipment. The facility will begin operations in October, increasing development and manufacturing capacity.
Lintec Files Patent Infringement Lawsuit over Chip Backside Protection Tape
Lintec filed a patent infringement lawsuit against Sanxuan Technology of China and its distributor in Taiwan. The company believes the products in question infringe its patents.
LINTEC announces resignation of outside director
LINTEC Corporation announced that outside director Takanori Sano resigned on September 8, 2026. The reason was that LINTEC would cease to be an equity-method affiliate following Nippon Paper Industries Co., Ltd.’s sale of its common shares in the company. The number of directors will remain compliant with applicable laws and the articles of incorporation.
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Public records
GOV
National Tax Agency basic information7011401006867
Source: National Tax Agency Corporate Number Publication Site, basic three items
Trade name
リンテック株式会社
Trade name (kana)
リンテック
Name in English
Corporation type
301
Address
〒173-0001 東京都板橋区本町23番23号
Postal code
1730001
Prefecture code
13
City code
119
Address outside Japan
Prefecture in English
City in English
Address outside Japan in English
Corporate number assignment date
2015-10-05
Update date
2018-05-16
Change date
2015-10-05
Registry closure date
Reason for registry closure
Successor corporate number
Details of the change
Latest record
1
Excluded from search
0
Processing type
01
Correction type
1
Trade name image ID
Address image ID
Sequence number
2263589
METI gBizINFO7011401006867
Source: gBizINFO (Ministry of Economy, Trade and Industry)