Arisawa Manufacturing Co., Ltd.

Founded by Tomitaro Arisawa through the manufacture of batten lace

Founded: April 8, 1909 (Meiji 42)

Registered as Toyo Blade Joint Stock Company the following year

Reorganized into Japan Blade Co., Ltd.

Japan Blade Co., Ltd. disbanded due to U.S. tariff increase in September: reorganized into Arisawa Manufacturing, operated by the first-generation director Tomitaro Arisawa

Disbanded due to U.S. tariff hikes and reorganized into Arisawa Manufacturing, personally managed by the first director, Tomitaro Arisawa

Started manufacturing electrical insulation tape

Started mass production of fastener tape

Expanded manufacturing facilities for electrical insulation tape

Reorganized into Arisawa Manufacturing Co., Ltd., established with capital of 20 million yen. Yuichi Arisawa appointed as president

Started development of glass fabric manufacturing technology: reorganized into Arisawa Manufacturing Co., Ltd., established with capital of 20 million yen: Chūichi Arisawa appointed as president

Established: July 1, 1949 (Showa 24)

Capital increased to 30 million yen. Expanded manufacturing facilities for glass cloth and synthetic fiber cloth

Capital increased to 30 million yen: expanded glass cross and synthetic fiber cross manufacturing facilities

Capital increased to 45 million yen

Started research on silicone rubber processing and established resin processing division

Shuichi Minowa appointed as president

Prototype of fiberglass ski announced

Expanded manufacturing facilities for silicone rubber glass cloth and glass tubes

Established Tokyo branch, Osaka branch, and Nagoya branch. Expanded resin processing facilities, started mass production of prepreg and Wani Cross. Capital increased to 60 million yen

Tokyo, Osaka, and Nagoya branch offices opened: increased resin processing facilities, mass production of prepreg and Wani Cross started: capital increased to 60 million yen

Increased capital to 100 million yen, listed on the Tokyo Securities Association Over-the-Counter Market

Increased capital to 200 million yen. Listed on the Second Section of the Tokyo Stock Exchange

Capital increased to 200 million yen, listed on the Second Section of the Tokyo Stock Exchange

Increased capital to 300 million yen

Resin processing equipment expansion, start of impregnation paper production for decorative panels

Established a factory in Nakatahara and installed new resin processing equipment

Started filament winding manufacturing

New impregnation coating equipment. Increased capital to 450 million yen

New impregnation coating equipment installed: capital increased to 450 million yen

Started manufacturing drawn molded products at Nakatahara factory

Merged with Arisawa Trading Co., Ltd., capital increased to 550 million yen

Expanded drawing molding equipment at Nakatahara factory. Started manufacturing mica tapes for heat-resistant and fire-resistant electric wires

Additional extrusion molding equipment at Nakatahara Factory: began manufacturing mica tapes for heat-resistant and fire-resistant electric wires

Started research on carbon fiber composite materials

Started manufacturing polarized films. Increased capital to 715 million yen

Polarizing film manufacturing started: capital increased to 715 million yen

Eiichi Arisawa appointed as president

Started manufacturing honeycomb sandwich panels for aircraft interiors. Established new glass cloth manufacturing equipment for printed wiring boards

Started manufacturing honeycomb sandwich panels for aircraft interiors: new glass cross manufacturing equipment for printed wiring boards

Expanded long-length filament winding manufacturing equipment. Established ultra-wide glass cloth manufacturing equipment for membrane structure buildings. Opened a screen factory and started manufacturing Fresnel lenses

Expanded long filament winding manufacturing equipment: new ultra-wide glass cross manufacturing equipment for membrane structures: opened screen factory and started manufacturing Fresnel lenses

New equipment for flexible printed wiring boards manufacturing

New processing equipment for glass cloth (for multi-layer) for printed wiring boards

Expanded manufacturing equipment for glass cloth for printed wiring boards

Expanded impregnation coating equipment, expanded Fresnel lens manufacturing equipment. Established a joint venture with Nippon Kayaku Co., Ltd., called Polatechno Co., Ltd.

Expanded impregnation coating and Fresnel lens manufacturing equipment: established joint venture Polatechno Co., Ltd. with Nippon Kayaku Co., Ltd.

Established a technology development center at Nakatahara factory

Mr. Mitsuji Arisawa was appointed as president

Expansion of flexible printed circuit board manufacturing equipment

Capital increased to 2,633,05,000 yen. Expansion of glass cloth manufacturing equipment for printed circuit boards. ISO9001 certification acquired

Capital increased to 2,633,050,000 yen: expanded glass cross manufacturing equipment for printed wiring boards: obtained ISO9001 certification

New installation of display lens sheet manufacturing equipment, expansion of Fresnel lens manufacturing equipment

Establishment of Nakatahara West Factory. Capital increased to 3,673,91,000 yen. Expansion of flexible printed circuit board manufacturing equipment, new μ-Pol manufacturing equipment

Established Nakatahara West Factory: capital increased to 3,673,910,000 yen: expanded flexible printed wiring board manufacturing equipment, new μ-Pol manufacturing equipment

Separation of glass cloth business and establishment of Arisawa Fiberglass Co., Ltd. Establishment of Color Link Japan Co., Ltd.

Separated glass cross business and established Arisawa Fiberglass Co., Ltd.: established Color Link Japan Co., Ltd.

Expansion of anti-reflective (AR) plate manufacturing equipment, expansion of flexible printed circuit board manufacturing equipment. Capital increased to 6,310,52,000 yen

Expanded anti-reflective (AR) plate manufacturing equipment, expanded flexible printed wiring board manufacturing equipment: capital increased to 6,310,520,000 yen

Reclassified to the First Section of the Tokyo Stock Exchange

Expansion of anti-reflective (AR) plate manufacturing equipment. Expansion of flexible printed circuit board manufacturing equipment. Expansion of Fresnel lens manufacturing equipment. Certified as Sony Green Partner (Nakatahara Factory)

Anti-reflection (AR) plate manufacturing equipment expansion: Flexible printed wiring board manufacturing equipment expansion: Fresnel lens manufacturing equipment expansion: Certified as Sony Green Partner (Nakatarahara Factory)

Established a factory in Nanakasho and installed new Fresnel lens manufacturing equipment. Established Myoko Factory in Myoko City. Expansion of flexible printed circuit board manufacturing equipment. Expansion of Fresnel lens manufacturing equipment

Established a new factory in Nanakasho and installed new Fresnel lens manufacturing equipment: Established a new Takada Factory in Myoko City: Expanded flexible printed wiring board manufacturing equipment: Expanded Fresnel lens manufacturing equipment

Certified as Sony Green Partner (Minamihonmachi Factory). Capital increased to 7,023,21,000 yen. Expansion of printed circuit board manufacturing equipment

Certified as Sony Green Partner (Minamihonmachi Factory): Increased capital to 7,023,210,000 yen: Expanded printed wiring board manufacturing equipment

ISO14001 certification. New technical building (Technical Development Center Building B) opened at Nakatahara Factory

ISO 14001 certification: Established a new technical building (Technology Development Center Building B) at Nakatarahara Factory

New Xpol® manufacturing equipment

Acquisition of shares of New Yang Technology Co., Ltd. (now a consolidated subsidiary)

Changed the name of Toyo Industry Co., Ltd. to Protec International Holdings Co., Ltd. (now a consolidated subsidiary), and acquired shares of Protec Arisawa Europe, S.A. and Protec Arisawa America, Inc.

Changed the name of the subsidiary Toyowa Sangyo to Protec International Holdings (now a consolidated subsidiary), and acquired shares of Protec Arisawa Europe, S.A. and Protec Arisawa America, Inc. (both now consolidated subsidiaries)

JIS Q 9100 certification. Expansion of flexible printed circuit board manufacturing equipment

JIS Q 9100 certification: Expanded flexible printed wiring board manufacturing equipment

Yuta Arisawa was appointed as president

Established Kansai Sales Office in Kyoto City (moved to Osaka City in March 2018)

Established Kansai Sales Office in Kyoto City (relocated Kansai Sales Office to Osaka City in March 2018)

Expansion of flexible printed circuit board manufacturing equipment

Acquisition of shares of Sato-sen Co., Ltd. (now a consolidated subsidiary)

Review of market classification at the Tokyo Stock Exchange leads to transition to the Prime Market

Reclassified from the First Section of the Tokyo Stock Exchange to the Prime Market due to review of market classification

Reorganization into two-headquarters system with Joetsu and Tokyo headquarters. Rebranding implemented. New small coating machine AI-coater for joint development established

Reorganized into two headquarters in Joetsu and Tokyo: Implemented rebranding: Established a small coating machine AI-coater for joint development

ARISAWA Innovation Center opened at Nakatahara Factory