Yamaha Robotics Co., Ltd. has decided to absorb and merge with Apic Yamada Precision Co., Ltd., a 100% subsidiary, effective January 1, 2027. This merger will make Yamaha Robotics the surviving company, integrating the management resources of both companies to strengthen business competitiveness and enhance customer value.
Yamaha Robotics Corporation will exhibit at SEMICON INDIA 2026, which will be held at Yashobhoomi in New Delhi from September 17 to 19, 2026. The booth number is 579. The company opened an India office in July 2026 and aims to contribute to the Indian semiconductor market.
Yamaha Robotics has established the "SEMI Business Support Department" within the Robotics Business Support Division of its Indian subsidiary YMIS. Operations will commence on July 1, 2026, strengthening sales and technical support systems in the Indian market. By adding semiconductor post-processing manufacturing equipment to existing SMT and FA, we provide a total solution covering from the assembly process to semiconductor post-processing.
Yamaha Robotics Inc. will exhibit at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC 2026) held in Florida, USA, from May 26 to 29, 2026. The venue is JW Marriott & The Ritz-Carlton Grande Lakes Resort, and the booth number is #125.
Yamaha Robotics Inc. will exhibit at SEMICON Southeast Asia 2026, held in Malaysia from May 5-7, 2026. The venue is MITEC (Kuala Lumpur), and the booth numbers are #2669 and #2701.
Yamaha Robotics Co., Ltd. has joined SATAS as a union member, aiming to streamline, automate, and standardize the post-semiconductor processing stage. It will continue to contribute to the development of post-semiconductor processing technology and further industry standardization.
Yamaha Robotics Corporation will exhibit at SEMICON CHINA 2026, which will be held from March 25 to 27, 2026, at the Shanghai New International Expo Center. The booth will showcase the latest technology and equipment of the product brand, located at booth N4 Hall 4463.
Yamaha Robotics, as of January 1, 2026, integrated its European liaison office AGL into Yamaha Motor's European subsidiary YME. Under the new structure, it will provide total solutions including SMT, FA, and semiconductor post-processing (SEMI), strengthening sales support and service systems in Europe.
As of January 1, 2026, we implemented changes to directors' dual roles and personnel transfers for department heads and division heads. Mr. Yasuhisa Miyata stepped down from his dual role as Head of Packaging Solutions Division, and Mr. Yoshiki Iijima stepped down from his dual role as Head of Technical Research. Mr. Toru Kawai was appointed as Head of Packaging Solutions Division, and Mr. Kunito Kawai was appointed as Head of Technical Research.
Yamaha Robotics Inc. will exhibit at the Advanced Packaging and Chiplet Summit (APCS) 2025, part of SEMICON JAPAN 2025, held at Tokyo Big Sight from December 17 to 19, 2025. We will introduce the latest technologies and equipment of the SHINKAWA Series, APIC YAMADA Series, and PFA Series, which support advanced packaging for semiconductor post-processing.