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住友電工デバイス・イノベーション株式会社
Semiconductor Devices
Electronic Components
Device Packaging and Assembly
Semiconductor device manufacturing
Electronic component manufacturing
Power electronic component manufacturing
High-performance material development
Device development & support services
〒244-0845 神奈川県横浜市栄区金井町1番地
15,000,000,000 円 (150 億円)

2026-02-07 17:24 (Model: gpt-oss:20b )