Flux for Wave SolderingTack FluxFlux Cored Solder WireHeat Curable SMT Adhesivefor Power Semiconductor DevicesProduction and Sales of Soldering MaterialsResearch & DevelopmentProduct QualityTechnical SupportProductionSalessoldering equipmentsub-materialsfluxautomatic soldering equipmentSMD curing ovenre-flow equipmentadhesives for SMDcream solderingsolder pastesfluxes
| 会社名 | Group | 親会社 | 子会社 | 得意先 | 仕入先 | 業務提携 | 銀行等 | 株主等 |
|---|---|---|---|---|---|---|---|---|
|
|
||||||||
|
Ding Yang Technology CO.,LTD
|
||||||||
|
EXTEND-ZAP CO.,LTD
|
||||||||
|
KOKI Deutschland
|
||||||||
|
KOKI ELECTRONIC MATERIALS (SUZHOU) CO., LTD
|
||||||||
|
KOKI Europe A
|
||||||||
|
Koki (Singapore) Pte Ltd.
|
||||||||
|
Koki Electronic Materials (Thailand) Co., Ltd.
|
||||||||
|
Koki Electronic Materials(Suzhou) Co., Ltd.
|
||||||||
|
Koki Europe A/S
|
||||||||
|
Koki Europe Sp. z.o.o. - Hungarian
|
||||||||
|
Koki Korea Co., Ltd.
|
||||||||
|
Koki Materials Sdn. Bhd
|
||||||||
|
Koki Sanei Korea Co., Ltd.
|
||||||||
|
TREND Electronics (M) Sdn.Bhd
|
||||||||
|
|
1964 : Koki Company, Ltd. was established and began importing from England in addition to sales commencement of soldering equipment and sub-materials.
In 1968 the company was reorganized as Koki Corporation.
1982 : SMD curing oven and re-flow equipment were developed. Sales were not limited to our own brand, but included sales to foreign markets such as Europe and the US for several large domestic mounter makers and OEM contracts. The SMT production line of foreign makers of large electronics and computers was adopted.
1985 : With experience in equipment sales in the surface packaging technology field, development, production and sales of adhesives for SMD and cream soldering began. At that time, other companies were introducing cream solder that used solder powder from spheres, which caused problem in manufacturing. This was a huge influence on clients in improving production technology for surface packaging of a high density.
Koki Sanei Korea Co., Ltd. was established as a joint venture in Korea. Production and sales of materials began. Based on trust and support from large companies in Korea, that market expanded and we took the initiative in advancing overseas factories. We currently have a large market share in the computer and cellular phone fields.
After taking over the technical department for sub-materials from Sanei Chemicals, production activities began. Summarization, development and production at the Koki / Higashi Matsuyama Plant commenced. A new organization that could quickly respond to client requests was constructed. We aim to make a jump in strengthening our ability to compete in the world market as the new powerful Koki.
In order to establish the Koki brand as a global enterprise, Koki Europe A/S was established in Denmark and in the suburb of Copenhagen in February 2001 as a local production and sales base for the European market.
Koki Europe has begun the production of solder pastes since October 2001.
KOKI ELECTRONIC MATERIALS (SUZHOU) CO., LTD was established as the main factory of Chinese market. Solder pastes and fluxes production was started form August 2003. The factory was certified ISO9001 and 14000.
KOKI Deutschland, a sales office in Germany, started operating in July.
In August, KOKI Europe A/S Hungary Branch office was established.
With increasing demand for larger production capacity, Higashimatsuyama Plant was extended in April.
To further increase production volume and enhance logistics, KOKI KOREA facilities were moved to a new location in June.
KOKI Solder America, Inc. was founded in September.
KOKI ELECTRONIC MATERIALS (SUZHOU) CO., LTD was relocated for expansion in March.
Opened a new distribution center in USA
KOKI Europe expressed gratitude to visitors who attended its booth at EFX 2026 in Stuttgart. The event, held from 6–8 October 2026 at Messe Stuttgart, was a success and provided an opportunity to discuss soldering challenges. KOKI showcased its latest soldering materials and application support solutions. The company highlighted its commitment to supporting the electronics manufacturing industry.
In order to address a PHP vulnerability discovered on October 21, 2026, KOKI Solder America, Inc. temporarily suspended its website. Following urgent investigation and software updates, the site resumed normal operation on October 23, 2026.
KOKI Europe will exhibit at EFX 2026, the Electronics Manufacturing Expo, held at Messe Stuttgart, Germany. The company will be located at Booth 9A21 from 6–8 October 2026. Attendees can discuss soldering challenges and learn about KOKI’s latest soldering materials and application support solutions to optimise SMT processes.
KOKI Solder America, Inc. expressed gratitude to customers, prospective customers, and business partners for visiting their booth at Productronica India 2026, held from 16th to 18th September in Bangalore. The company showcased its latest power device product, hoping to generate interest among attendees.
KOKI SINGAPORE PTE LTD will exhibit at the SMTA EXPO & TECH FORUM in Penang, Malaysia, from September 23 to 24, 2026. The booth will showcase the latest halogen‑free, ultra‑low void, high‑wettability lead‑free solder paste, S3X58‑HF1200, featuring state‑of‑the‑art flux technology.
KOKI thanked customers, prospects, and partners who visited its booth at PCIM Asia Shenzhen 2026, held August 26–28 at Hall 16, Booth H07. The company highlighted its E Series solder paste for formic-acid reflow, which delivers ultra-low voiding and zero flux residue, eliminating post-solder cleaning and reducing process costs.
KOKI Solder America thanked customers, prospective customers, and business partners who visited its booth at PCIM 2026 in Nuremberg, Germany, from June 9–11. The exhibition provided an opportunity to showcase the company’s latest products for power devices.
Koki established its Thailand factory in November 2024 as a manufacturing and sales base for the Asian market, and it is now in operation. The factory is positioned to support KOKI’s business expansion in Asia and strengthen business continuity. It is working to adopt the production and quality management systems used in Japan to provide high-quality, consistent products.
KOKI Solder America thanked customers, prospective customers, and business partners who visited its booth at Productronica 2025 in Munich, held November 18–21, 2025. The exhibition provided an opportunity to showcase its latest products for power devices and SMT.
KOKI will exhibit at NEPCON Shenzhen 2025 at the Shenzhen World Exhibition & Convention Center in China from October 28 to 30, 2025. Its booth will feature four newly developed solder paste series targeting higher reliability, reduced voiding, cost competitiveness, and advanced power device applications.