サムコ株式会社

Samco International, Inc. was established

Released large CVD system for semiconductor process

Released Japan’s first MOCVD system

Opened Tokyo branch office

Moved HQ to current location and started selling products of March Instruments Inc. (now NORDSON CORPORATION)

Opened OPTO films research laboratory in Sunnyvale

Released LSCVD® system for processing of TEOS SiO2 film

Opened R&D Center I in Kyoto

Opened Tsukuba Office

Opened Tokai Branch

Released ferroelectric film deposition system using technology of Symetrix Corporation.

Developed the CFC pollution-free technique using thin film technology

Released compact reactive ion etching system RIE-10NR

Released ICP etching system RIE-101iP

Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd.

Released ICP etching system RIE-200iP

Released compact PECVD system PD-220

Acquired field support business from Samco Engineering Co., Ltd.

Opened Cambridge Research Laboratory at University of Cambridge, UK

Became publicly listed in JSDA Over-the-Counter Trading Securites Market

Opened Taiwan Office

Opened Production Center I in Kyoto

Released production type PECVD system PD-220LC

ロバート・ボッシュ株式会社からの高速シリコン深堀技術を導入

Opened Shanghai Office

Changed company name to Samco Inc.

Withdrew from JSDA Over-the-Counter Trading Securites Market and became publicly listed in JASDAQ Securities Exchange Market

Released plasma CVD system PD-2203L (Cluster Lab) for general purpose

Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of Cambridge

Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrate

Opened Product Service Center

Released dry etching system RIE-800iPB for MEMS

Signed a collaborative research agreement with Tsinghua University (China)

Released ICP etching system RIE-140iP for LD

Opened R&D Center II in Kyoto

Released production type MOCVD system MCV-2018 for GaN film deposition

Established a subsidiary, Samco Global Service Inc., in Taiwan for field support

Released production type ICP etching system RIE-330iPC for LED

Started running of Samco Global Service Inc.

Held 30th anniversary event at Kyoto Hotel Okura

Released R&D type dry etching system RIE-400iPB for MEMS

Became listed in Osaka Securies Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc.

Released production type plasma CVD system PD-330STC for TSV

Released production type plasma CVD system PD-5400 for LED

Opened East Coast Office in North Carolina, U.S. (Relocated in New York in May 2014)

Opened Beijing Office

Released production type ICP etching system RIE-331iPC for LED

Released ICP etching system RIE-600iP for SiC power device

Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second Section

Released production type ICP etching system RIE-600iPC for SiC power device

Released production type RIE system RIE-800iPBC for MEMS

Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section

Transferred Samco’s stock listing to Tokyo Stock ExchangeMmarket First Section

Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.)

Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG)

Opened Fukuoka Office

Released ALD system AL-1 for electronic devices

Increased capital to JPY 1.66 billion through public offering

Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden)

Released ALD system AL-1 for electronic devices

Opened Production Center II in Kyoto

マレーシアオフィスを開設

Released Aqua Plasma® cleaner AQ-2000

Released compact ICP etching system RIE-200iPN

Held 40th anniversary event at Kyoto Hotel Okura

先端技術開発棟の建設を開始

先端技術開発棟（京都市伏見区）が完成

原子層レベルの加工を実現するALE装置の開発、販売を開始

2反応室ALD装置AD-8002LPCの開発、販売を開始