Packaging technology equipment and services
Laser soldering
Wire soldering
3D and 3.5D packaging
Flip chip
Probe card
WLP services
Cu pillar
はんだバンピング
レーザーアシストボンディング
ウェーハレベルの部品実装
ウェーハの薄型化
バックサイドメタル
SB²
LAPLACE
Ultra-SB²
PACLINE
Packaging Technology Equipment & Services
Advanced Packaging Equipment
Wafer Level Packaging
Laser soldering and bonding
Non-enzymatic and electrolytic plating
Ball and wire soldering
3D/3.5D packaging solutions
Flip chip and probe card manufacturing
Solder rework and SMT services
Aerospace, automotive, home appliances, energy/solar, medical, electronic components and PCB solutio
SB2 RSP Machine and related products (SB², LAPLACE, Ultra-SB², PACLINE)
Cu pillar and RDL services
再配線層 (RDL) のサービス
Advanced manufacturing equipment
Wafer-level packaging services
Laser-assisted bonding
Electroless plating
Solder ball installation
Solder rework
Surface-mount technology (SMT)
Backside metal
Dicing
Rewire layer (RDL)
Solder bumping
Wafer-level component installation
Wafer thinning
Electroplating
