| 1963-05 |
Founded as Ome Electronics Kogyousho Co., Ltd. under the group umbrella of the Semiconductor Division of Hitachi, Ltd. |
| 1963-10 |
Started manufacturing stems for germanium transistors |
| 1965-11 |
Gained recognition for opening a canteen for our staff and received a letter of appreciation for our cooperation in the promotion of welfare from the Governor of Tokyo |
| 1969-08 |
Changed company name to Hitachi Ome Electronics Kogyousho Co., Ltd. |
| 1973-11 |
Started manufacturing power IC |
| 1977-06 |
Inauguration of Precision Center as semiconductor device fabrication department |
| 1977-08 |
Started manufacturing a new power IC product (new SIL) |
| 1978-02 |
Changed company name to Hitachi Ome Denshi Co., Ltd. |
| 1979-04 |
Started semiconductor fabrication equipment development, manufacturing, and servicing operations |
| 1979-11 |
Started manufacturing high speed full automatic wire bonder (AUTAS) |
| 1981-08 |
Opened Hamura Plant (in Ome, Tokyo) |
| 1985-04 |
Changed company name to Hitachi Tokyo Electronics Co., Ltd. |
| 1985-12 |
Ultra sensitive gas analyzer (Atmospheric pressure ionization mass spectrometer) won a "10 great new products" award presented by the Nikkan Kogyo Shimbun (The Daily Industrial News) in 1985. |
| 1989-04 |
Started manufacturing Pellet Bonder PB Series |
| 1991-05 |
Yamanashi Plant starts operation |
| 1991-05 |
Started manufacturing high speed and high precision LOC mounter LM Series |
| 1991-05 |
Started manufacturing die boner DB Series for general-purpose products |
| 1992 |
Started manufacturing die bonder CM Series specially designed for DRAM |
| 1996-09 |
Acquired ISO9001 certification |
| 1998-07 |
Acquired ISO14001 certification |
| 1999-02 |
Takasaki Equipment Department integrated into Yamanashi Plant |
| 2000-12 |
Marketing of world’s first 300 mm compatible equipment (DB530) begins |
| 2002 |
Eastern Japan Semiconductor Technologies, inc. established. Note: Merger with Hitachi Tohbu Semiconductor, Ltd. and Sagami Plant of Hitachi Hokkai Semiconductor, Ltd. |
| 2003-10 |
Company name changed to Renesas Eastern Japan Semiconductor, inc. |
| 2004-03 |
Marketing Department integrated into Yamanashi Plant |
| 2005 |
Top market share for die bonders worldwide |
| 2010-04 |
Equipment Division of Renesas Eastern Japan Semiconductor, inc. integrated into Hitachi High-Tech Instruments Co., Ltd. |
| 2010-12 |
The Japanese government lauds research institutions and companies involved in the development of the Hayabusa spacecraft used for exploration of the asteroid Itokawa. Our equipment was integrated in the plant for analysis of the sample returned to earth and thereby contributed to the Hitachi Group receiving recognition. |
| 2011 |
Won a CS Award presented by VLSI |
| 2015-03 |
Bonding Equipment Division of Hitachi High-Tech Instruments Co., Ltd. split off to form Fasford Technology Co., Ltd. |
| 2015-04 |
Fasford Technology Co., Ltd. established as independent company |
| 2016-10 |
Started manufacturing high-speed high-performance automatic die bonder DD Series |
| 2017-11 |
Won the grand prize in the category "Manufacturing" of Yamanashi Industry Awards |
| 2018-08 |
Joined the corporate group of FUJI CORPORATION |
| 2019-11 |
New office building completed |
| 2020-06 |
The shipment quantity of the devices that support 300mm reached 5000 |
| 2021-12 |
Warehouse building completed |
| 2023-12 |
R&D (Research and Development) Building Completed |
