TAKEI CO.,LTD.

The company was founded in 1936 as a repair shop for Motor and Transformer.

Founded in Higashimachi, Kurume City (sole proprietorship): Engaged in motor repair.

Founded in Higashimachi, Kurume. : Opened a repair shop for motors.

Established the general partnership Takei Electric Manufacturing: Began control of machine tools and design/manufacture of panels.

Established Takei Electric Factory : Control of a machine tool, design fabrication of operation board.

Reorganized into Takei Electric Industrial Co., Ltd. (capital 2 million yen).

Reorganized into Takei Electric Industries Co., Ltd. (Capital:JPY2,000,000)

Designed and manufactured control panels using contactless relays: Designed, manufactured, and installed electrical equipment for water treatment plants.

Design fabrication of control panel used static relay. : Design fabrication of electric components for water treatment plant

Started design and manufacture of analog control using ICs and LSIs.

Design fabrication of analog control with IC and LSI.

Relocated factory to Miyaki Town, Miyaki District.

Started manufacturing SCR (static) Leonardo for paper mills and steel mills at the new factory.

The factory moved to Miyaki-cho, Miyaki-gun.

Started the fabrication of SCR Leonard for paper and steel mills.

Headquarters established at Edo-Yashiki, Kurume City: Designed and manufactured digital control devices using ICs, LSIs, MOSICs, etc.

Located the head office at Edoyashiki in Kurume. : Design fabrication of digital control system used IC, LSI, and MOSIC.作

Established the Machinery Division.

Established machinery business division.

Completed prototypes of two industrial robots (2 heads, 10 axes).

Manufactured two prototype industrial robots (2heads, 10axes)

Established the FA Systems Division (phased out the Machinery Division).

Established FA System Division.

Commenced production of disk equipment for optical media.

Started a production of optical media discs.

Started development of image processing control systems.

Entered an engineering business partnership with Fuji Electric Co., Ltd. for image processing.

Started development of image processing control system.

Engineering business alliance with Fuji Electric Co., Ltd. for image processing.

Started research and development of semiconductor post-processing / high-speed wire bonding.

Started R&D of semiconductor post-process and high-speed wire bonder.

Manufactured a high-speed wire bonder prototype. : R&D for special die bonder.

R&D for semiconductor front-end process and cleaning equipment.

Increased capital to 98.3 million yen.

R&D for wafer-saving resist spin coater.

Completed prototype of high-speed wire bonding: Implementation test and special die bonding R&D.

Research and development of semiconductor pre-processing / cleaning equipment.

Obtained ISO9001 certification.

After several capital increases, the capital stock is 98.3 million yen.

Research and development of wafer-level resist spin coating.

Started a production of liquid crystal process equipment.

Obtained ISO 9001 certification.

A clean room was placed in the factory.

Commenced production of liquid crystal process equipment.

Started a production of PDP process equipment.

Installed a cleanroom and began production of ultra-clean systems.

Commenced production of PDP process equipment.

As a new business, we have been working on Laser Processing Technology since 2003, have developed and commercialized a device for removing thin films using a laser.

Developed ITO transparent electrode laser processing system. : (The first built machine)

Developed an ITO transparent electrode laser processing device (Unit 1).

The Kurume factory was newly built. : (Tsubukuhonnmachi, Kurume)

Established a new Kurume factory (Tsubukihoncho, Kurume City).

Started a production of process unit for solar cell production.

Obtained ISO14001 certification.

Commenced production of solar cell production process equipment.

Obtained ISO 14001 certification.

Head office moved to 2617, Eguchi, Miyaki-cho, Miyaki-gun, Saga.

Moved headquarters to 2617 Eguchi, Miyaki Town, Miyaki District, Saga Prefecture.

Thin-film removal method and its system used by laser processing equipment. : (Patented No.4887086)

Manufacturing license agreement with Meta water Co., Ltd for high-voltage panels and system control panels.

Dust-collecting equipment for laser processing : (Patented No.5063239)

Laser processing device for thin film removal method and device (Patent No. 4887086).

Thin film removal method for thin film laminated glass substrate and its system : (Patented No.5207306)

Adopted by NEDO's subsidized program for practical development of thin film laser patterning equipment for functional films.

Chosen as a manufacturing subcontract factory for high-pressure plates and system control panels by Meta Water Co., Ltd.

Calibration method and its program in laser processing equipment. : (Patented No.5311396)

Laser processing dust collection device (Patent No. 5063239).

R&D to improve the function of laser cleaning equipment is adopted for "Monozukiri subsidy" (Saga)

Thin film removal method and device for laminated glass substrates (Patent No. 5207306).

The practical development of a thin film laser patterning device for functional films was selected for NEDO grant funding.

Calibration method and program for laser processing devices (Patent No. 5311396).

Research and development to improve the functionality of laser cleaning devices was selected for the "Manufacturing Grant" (Saga Prefecture).

Wafer Separation method and its separator. : (Patented No.5585911)

The practical development of a laser cutting device that suppresses the heat effect for functional films for touch panel displays is adopted as a support project of Ministry of Economy, Trade and Industry.

Wafer separation method and wafer transfer device (Patent No. 5585911).

The practical development of a laser cutting device that suppresses thermal effects for functional films used in touch panel displays was selected for the Ministry of Economy, Trade and Industry's Support Project.

Laser processing method and equipment : (Patented No.6035461)

Selected as one of the 300 flapping SMEs and small businesses and received the award from the Minister of Economy, Trade and Industry

Laser processing method and laser processing device (Patent No. 6035461)

Received the Invention Encouragement Award at the 2017 Kyushu Regional Invention Awards sponsored by the Japan Institute of Invention and Innovation

Selected by the Ministry of Economy, Trade and Industry as a "regional future traction company".

Received the Kyushu Economic and Industrial Bureau Award at the 7th 'Made in Japan Award'.

Received the Kyushu Bureau of Economy, Trade and Industry Award at the 7th "Monozukuri Japan Award".

Selected among 300 small and medium-sized enterprises and small businesses, receiving an award from the Minister of Economy, Trade and Industry.

Received the Innovation Encouragement Award at the 2017 Kyushu Regional Innovation Awards hosted by the Public Interest Incorporated Association of Invention.

Selected as a 'Regional Future Leading Company' by the Ministry of Economy, Trade and Industry as a core enterprise in the region for leading regional economic development projects.