株式会社弘輝
KOKI Company Ltd.
Alias
Japan
はんだ付け関連電子材料の製造販売
自動はんだ付装置の開発・製造・販売
製品
技術サポート
ネットワーク
ソルダーペースト
ポストフラックス
タックフラックス
やに入りはんだ
熱硬化型接着剤
パワーデバイス向け
車載
民生・産業機器
モバイル・スマートデバイス
電子部品
パワーデバイス
電子材料(フラックス、酸化防止剤、ソルダーペースト、接着剤)の開発・製造・販売
SMD用リフロー装置の開発・製造・販売
無残渣ペーストの開発・販売
〒120-0026 東京都足立区千住旭町32-1
150 people
Company name
Group
Parent
Subsidiary
Customer
Supplier
Alliance
Bank
Shareholder
Ding Yang Technology CO.,LTD
Group
Subsidiary
EXTEND-ZAP CO.,LTD
Group
Subsidiary
Koki (Singapore) Pte Ltd.
Group
Subsidiary
Koki Materials Sdn. Bhd
Group
Subsidiary
Koki Solder America Inc.
Group
Subsidiary
TREND Electronics (M) Sdn.Bhd
Group
Subsidiary
Trend Electronics (Thailand)Co., Ltd.
Group
Subsidiary
Allpoint Electronics LTDA
Customer
B&G Chemicals Ltd.
Customer
Bergen Systems Pvt. Ltd.
Customer
Ding Sheng International Co.,Ltd
Customer
Fraser Technologies Ltd
Customer
Goldtek Company Limited
Customer
Koki Electronic Materials(Suzhou) Co., Ltd.
Customer
Koki Europe Sp. z.o.o.
Customer
Koki Europe Sp. z.o.o. - Hungarian
Customer
Koki Korea Co., Ltd.
Customer
Koki Solder America, Inc.
Customer
Matronic I Sverige AB
Customer
Mettatron Group Co., Ltd.
Customer
Necten Electronica S.A.
Customer
Shanghai Yazun Trading Co.,Ltd
Customer
Shenzhen Hongming Technology Co.Ltd.
Customer
Loading...
Loading the relationship graph...
6 entries
| Date | Description |
| 1964 |
Koki Company, Ltd. was established and began importing from England in addition to sales commencement of soldering equipment and sub-materials. |
| 1964 |
私たちの前身となる有限会社弘輝商会を設立しました。 |
| 1968 |
In 1968 the company was reorganized as Koki Corporation. |
| 1968 |
現在の会社となる株式会社弘輝に改組しました。 |
| 1982 |
SMD curing oven and re-flow equipment were developed. Sales were not limited to our own brand, but included sales to foreign markets such as Europe and the US for several large domestic mounter makers and OEM contracts. The SMT production line of foreign makers of large electronics and computers was adopted. |
| 1985 |
With experience in equipment sales in the surface packaging technology field, development, production and sales of adhesives for SMD and cream soldering began. At that time, other companies were introducing cream solder that used solder powder from spheres, which caused problem in manufacturing. This was a huge influence on clients in improving production technology for surface packaging of a high density. |
2026-09-21 18:07 (Model: gpt-4.1-nano )