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Samco Corporation

サムコ株式会社Samco Inc.Alias
Ticker
Listed market
TYO
Country
Japan
Employees (consolidated)
191
Related companies
8
§01

Basic information

BASIC
Head office
36 Takeda Warayacho, Fushimi-ku, Kyoto 612-8443, Japan
Chief executive
Fumi Kawabe
Capital
1,663,680,000  (16 100 million)
Employees (non-consolidated)
183 people
Employees (consolidated)
191 people
Start date
1979-09-01
End date
§02

Websites

1 DOMAINS
§03

Business

5
CVD EquipmentDry Etching EquipmentDry Cleaning EquipmentManufacturing and Sales of Semiconductor and Electronic Component Manufacturing EquipmentSemiconductor Manufacturing Equipment
§04

Related companies

8 COMPANIES
Company name Group Parent Subsidiary Customer Supplier Alliance Bank Shareholder
samco-ucp ltd.
Group Subsidiary
Samco Global Service Co., Ltd.
Group
Samco Co., Ltd.
Group
オプトフィルムス研究所
Group Subsidiary
サムコエンジニアリング株式会社
Group
サムコ科学技術振興財団
Group
リヒテンシュタイン公国UCP Processing Ltd.
Group
Kirin Brewery Co., Ltd.
Alliance
Names without a link are companies not yet registered in OpenBizGraph
§05

Network

NETWORK
Drag to move · click to open
§06

History

69 EVENTS

Samco International, Inc. was establishedSources

Released large CVD system for semiconductor processSources

Released Japan’s first MOCVD systemSources

Opened Tokyo branch officeSources

Moved HQ to current location and started selling products of March Instruments Inc. (now NORDSON CORPORATION)Sources

Opened OPTO films research laboratory in SunnyvaleSources

Released LSCVD® system for processing of TEOS SiO2 filmSources

Opened R&D Center I in KyotoSources

Opened Tsukuba OfficeSources

Opened Tokai BranchSources

Released ferroelectric film deposition system using technology of Symetrix Corporation.Sources

Developed the CFC pollution-free technique using thin film technologySources

Released compact reactive ion etching system RIE-10NRSources

Released ICP etching system RIE-101iPSources

Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd.Sources

Released ICP etching system RIE-200iPSources

Released compact PECVD system PD-220Sources

Acquired field support business from Samco Engineering Co., Ltd.Sources

Opened Cambridge Research Laboratory at University of Cambridge, UKSources

Became publicly listed in JSDA Over-the-Counter Trading Securities MarketSources

Opened Taiwan OfficeSources

Opened Production Center I in KyotoSources

Released production type PECVD system PD-220LCSources

Introduced high speed silicon deep etching technology from Robert Bosch GmbHSources

Opened Shanghai OfficeSources

Changed company name to Samco Inc.Sources

Withdrew from JSDA Over-the-Counter Trading Securities Market and became publicly listed in JASDAQ Securities Exchange MarketSources

Released plasma CVD system PD-2203L (Cluster Lab) for general purposeSources

Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of CambridgeSources

Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrateSources

Opened Product Service CenterSources

Released dry etching system RIE-800iPB for MEMSSources

Signed a collaborative research agreement with Tsinghua University (China)Sources

Released ICP etching system RIE-140iP for LDSources

Opened R&D Center II in KyotoSources

Released production type MOCVD system MCV-2018 for GaN film depositionSources

Established a subsidiary, Samco Global Service Inc., in Taiwan for field supportSources

Released production type ICP etching system RIE-330iPC for LEDSources

Started running of Samco Global Service Inc.Sources

Held 30th anniversary event at Kyoto Hotel OkuraSources

Released R&D type dry etching system RIE-400iPB for MEMSSources

Became listed in Osaka Securities Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc.Sources

Released production type plasma CVD system PD-330STC for TSVSources

Released production type plasma CVD system PD-5400 for LEDSources

Opened East Coast Office in North Carolina, U.S. (Relocated in New York in May 2014)Sources

Opened Beijing OfficeSources

Released production type ICP etching system RIE-331iPC for LEDSources

Released ICP etching system RIE-600iP for SiC power deviceSources

Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second SectionSources

Released production type ICP etching system RIE-600iPC for SiC power deviceSources

Released production type RIE system RIE-800iPBC for MEMSSources

Transferred Samco’s stock listing to Tokyo Stock Exchange Market First SectionSources

Transferred Samco’s stock listing to Tokyo Stock Exchange Market First SectionSources

Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.)Sources

Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG)Sources

Opened Fukuoka OfficeSources

Released ALD system AL-1 for electronic devicesSources

Increased capital to JPY 1.66 billion through public offeringSources

Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden)Sources

Released ALD system AL-1 for electronic devicesSources

Opened Production Center II in KyotoSources

Opened Malaysia OfficeSources

Released Aqua Plasma® cleaner AQ-2000Sources

Released compact ICP etching system RIE-200iPNSources

Held 40th anniversary event at Kyoto Hotel OkuraSources

Started construction of the advanced technology development buildingSources

Completed the advanced technology development building (Fushimi-ku, Kyoto City)Sources

Started development and sales of ALE equipment that achieves atomic layer level processingSources

Started development and sales of 2-reactor ALD equipment AD-8002LPCSources

§07

News

75 ARTICLES

Samco Ships 5,000th Semiconductor Equipment Unit to Tohoku UniversitySources

To mark cumulative sales of 5,000 units of equipment including plasma CVD and dry etching systems, Samco Inc. shipped its RIE-200NL reactive ion etching system to Tohoku University. The system will be installed at a university research center and used for research and development and talent training.

2026 Fiscal Year 10th Research Grant Recipients AnnouncedSources

Samco Corporation has announced 12 recipients for the 2026 fiscal year's research grants. Please see the official website for details.

New employees visit partner companies to deepen technical understandingSources

New employees of Samco Corporation visited partner companies near Kyoto and learned about high-quality management and advanced technology through manufacturing sites.

EMBA students from Virginia Commonwealth University visit SamcoSources

EMBA students and faculty from VCU visited the Kyoto headquarters to learn about the company's history, semiconductor technology, and management philosophy.

Samco Corporation Hosts Social Gathering with Partner CompaniesSources

Samco Corporation invited partner companies to a social gathering aimed at strengthening relationships and exchanging opinions, discussing initiatives for future collaboration.

Samco Co., Ltd.'s 2026 New Employee OrientationSources

Seven new employees joined the company and received words of welcome and encouragement from the president, who also conveyed the importance of action guidelines and the challenge of change.

The 10th Research Grant Call for 2026 Has EndedSources

The 10th research grant call for 2026 ended on March 15.

Samco hosts lecture by Professor Matsuo of Hokkaido UniversitySources

Delivered a lecture on the latest trends and market outlook of ALD technology, which is crucial for semiconductor miniaturization, to aid future technology development.

Samco Seeks to Strengthen Cooperation Through Visit to ITRISources

Osamu Tsuji, Representative Director and Chairman of Samco Corporation, visited the Industrial Technology Research Institute (ITRI) in Hsinchu, Taiwan, on February 2, 2026, and exchanged views on deepening cooperation, particularly in semiconductor process technology. Discussions focused on advanced technologies such as silicon photonics, optoelectronic convergence, and chiplet architectures, and also reviewed the two parties’ past cooperation. They indicated their intention to strengthen their cooperative framework, including joint research and personnel exchanges, to contribute to the development of science and technology in Japan and Taiwan.

Samco strengthens collaboration through visit to Taiwan ITRISources

Chairman Tsuji of Samco Corporation visited the Industrial Technology Research Institute (ITRI) in Taiwan and discussed the possibilities of semiconductor technology and joint research.

§08

Public records

GOV
National Tax Agency basic information4130001014511
Source: National Tax Agency Corporate Number Publication Site, basic three itemsSources
Trade name
サムコ株式会社
Trade name (kana)
サムコ
Name in English
Corporation type
301
Address
〒612-8443 京都府京都市伏見区竹田藁屋町36番地
Postal code
6128443
Prefecture code
26
City code
109
Address outside Japan
Prefecture in English
City in English
Address outside Japan in English
Corporate number assignment date
2015-10-05
Update date
2018-10-25
Change date
2015-10-05
Registry closure date
Reason for registry closure
Successor corporate number
Details of the change
Latest record
1
Excluded from search
0
Processing type
01
Correction type
1
Trade name image ID
Address image ID
Sequence number
3908363
METI gBizINFO4130001014511
Source: gBizINFO (Ministry of Economy, Trade and Industry)Sources
Corporate number
4130001014511
Trade name
サムコ株式会社
Trade name (kana)
サムコ
Trade name (alphabet)
Registry closure date
Reason for registry closure
Registered address
京都府京都市伏見区竹田藁屋町36番地
Postal code
6128443
Prefecture
京都府
Prefecture code
26
City or district
京都市伏見区
City code
109
Street address
竹田藁屋町36番地
Organisation type
301
Processing type
01
Correction type
1
Status
Representative
代表取締役社長    川邊  史
Capital
1663687000
Employees
191
Employees (male)
Employees (female)
Business summary
Website URL
Year founded
Business category
Date established
1979-09-01
Unified government qualification - grade
B|A|A|
Unified government qualification - business items
116|118|216|218|309
Update date
2018-10-25
Key information
4130001014511
§09

Sources & updates

SOURCES
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