| 1979-09 |
Samco International, Inc. was established |
| 1980-07 |
Released large CVD system for semiconductor process |
| 1981-04 |
Released Japan’s first MOCVD system |
| 1984-07 |
Opened Tokyo branch office |
| 1985-06 |
Moved HQ to current location and started selling products of March Instruments Inc. (now NORDSON CORPORATION) |
| 1987-02 |
Opened OPTO films research laboratory in Sunnyvale |
| 1990-11 |
Released LSCVD® system for processing of TEOS SiO2 film |
| 1991-03 |
Opened R&D Center I in Kyoto |
| 1993-02 |
Opened Tsukuba Office |
| 1993-09 |
Opened Tokai Branch |
| 1994-02 |
Released ferroelectric film deposition system using technology of Symetrix Corporation. |
| 1995-07 |
Developed the CFC pollution-free technique using thin film technology |
| 1995-12 |
Released compact reactive ion etching system RIE-10NR |
| 1996-12 |
Released ICP etching system RIE-101iP |
| 1997-11 |
Developed DLC (diamond-like carbon) film coating technology on plastic bottles in collaboration with Kirin Brewery Co., Ltd. |
| 1997-11 |
Released ICP etching system RIE-200iP |
| 1998-12 |
Released compact PECVD system PD-220 |
| 1999-07 |
Acquired field support business from Samco Engineering Co., Ltd. |
| 2000-01 |
Opened Cambridge Research Laboratory at University of Cambridge, UK |
| 2001-05 |
Became publicly listed in JSDA Over-the-Counter Trading Securities Market |
| 2001-07 |
Opened Taiwan Office |
| 2002-07 |
Opened Production Center I in Kyoto |
| 2003-11 |
Released production type PECVD system PD-220LC |
| 2003-12 |
Introduced high speed silicon deep etching technology from Robert Bosch GmbH |
| 2004-11 |
Opened Shanghai Office |
| 2004-12 |
Changed company name to Samco Inc. |
| 2004-12 |
Withdrew from JSDA Over-the-Counter Trading Securities Market and became publicly listed in JASDAQ Securities Exchange Market |
| 2005-05 |
Released plasma CVD system PD-2203L (Cluster Lab) for general purpose |
| 2005-09 |
Provided to British business the technology of mass-producing ferroelectric-carbon nanotubes which was developed together with University of Cambridge |
| 2005-12 |
Released compact batch-type plasma cleaning system PC-300 for cleaning electronic substrate |
| 2006-03 |
Opened Product Service Center |
| 2006-05 |
Released dry etching system RIE-800iPB for MEMS |
| 2006-09 |
Signed a collaborative research agreement with Tsinghua University (China) |
| 2007-11 |
Released ICP etching system RIE-140iP for LD |
| 2008-03 |
Opened R&D Center II in Kyoto |
| 2008-05 |
Released production type MOCVD system MCV-2018 for GaN film deposition |
| 2008-10 |
Established a subsidiary, Samco Global Service Inc., in Taiwan for field support |
| 2008-11 |
Released production type ICP etching system RIE-330iPC for LED |
| 2009-01 |
Started running of Samco Global Service Inc. |
| 2009-04 |
Held 30th anniversary event at Kyoto Hotel Okura |
| 2009-10 |
Released R&D type dry etching system RIE-400iPB for MEMS |
| 2010-04 |
Became listed in Osaka Securities Exchange JASDAQ Market (now TSE JASDAQ (standard) market) as a result of the merge of Osaka Securities of Exchange, Co., Ltd. and Jasdaq Securities Exchange, Inc. |
| 2010-07 |
Released production type plasma CVD system PD-330STC for TSV |
| 2010-07 |
Released production type plasma CVD system PD-5400 for LED |
| 2010-08 |
Opened East Coast Office in North Carolina, U.S. (Relocated in New York in May 2014) |
| 2010-09 |
Opened Beijing Office |
| 2011-12 |
Released production type ICP etching system RIE-331iPC for LED |
| 2012-11 |
Released ICP etching system RIE-600iP for SiC power device |
| 2013-07 |
Transferred Samco’s stock listing to Tokyo Stock Exchange Market Second Section |
| 2013-10 |
Released production type ICP etching system RIE-600iPC for SiC power device |
| 2013-11 |
Released production type RIE system RIE-800iPBC for MEMS |
| 2014-01 |
Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section |
| 2014-01 |
Transferred Samco’s stock listing to Tokyo Stock Exchange Market First Section |
| 2014-03 |
Signed distribution agreement of MOCVD systems with Valence Process Equipment Inc. (U.S.) |
| 2014-05 |
Acquired UCP Processing (Lichtenstein) as a subsidiary (Later renamed as samco-ucp AG) |
| 2014-09 |
Opened Fukuoka Office |
| 2015 |
Released ALD system AL-1 for electronic devices |
| 2015-09 |
Increased capital to JPY 1.66 billion through public offering |
| 2015-12 |
Signed distribution agreement of SiC epitaxial CVD system with Epiluvac AB (Sweden) |
| 2015-12 |
Released ALD system AL-1 for electronic devices |
| 2016-06 |
Opened Production Center II in Kyoto |
| 2016-08 |
Opened Malaysia Office |
| 2016-09 |
Released Aqua Plasma® cleaner AQ-2000 |
| 2018-12 |
Released compact ICP etching system RIE-200iPN |
| 2019-09 |
Held 40th anniversary event at Kyoto Hotel Okura |
| 2024-05 |
Started construction of the Advanced Technology Development Building |
| 2025-09 |
Completed the Advanced Technology Development Building (Fushimi-ku, Kyoto City) |
| 2025-12 |
Started development and sales of ALE equipment that achieves atomic layer level processing |
| 2026-03 |
Developed and started sales of 2-reactor ALD equipment AD-8002LPC |
