Open company graph database — free web & API
ログイン

MACNICA CYTECH LIMITED

Macnica Cytech別名Macnica Cytech Limited別名MACNICA CYTECH別名
銘柄コード
—
上場市場
—
国
Hong Kong
従業員(単独)
—
関連会社
35
§01

基本情報

BASIC
所在地
Hong Kong
社長
従業員数(単独)
従業員数(連結)
開始日
1998-01-01
終了日
§02

サイト

1 DOMAINS
§03

事業内容

13
ProductsDevelopment kitstechnical supportdemand creationmeeting global supplyindustrial control applicationsRF solutionsself-developed module and development boardGlobal Product LineLocal Chinese Product LineECO System PartnerServicesSolutions
§04

関連会社

35 COMPANIES
会社名 Group 親会社 子会社 得意先 仕入先 業務提携 銀行等 株主等
株式会社マクニカ テクスターカンパニー
Group
骏龙科技
Group
烽火通信科技有限公司
得意先
Altera Corporation (M) Sdn Bhd
仕入先 業務提携
ADI
仕入先
株式会社サイプレス・スナダヤ
仕入先
互動國際數位股份有限公司
仕入先
Infineon Technologies AG
仕入先
intellim Holdings Corporation
仕入先
Samplify Systems
仕入先
Sensirion Holding AG
仕入先
瑞萨电子
仕入先
英特尔
仕入先
英飞凌
仕入先
Gridspertise
業務提携
Octera
業務提携
BroadLight
株式会社コアロジ
Cytech Global Limited
Ecliptek Corporation
Fiberhome
Junlong Technology
Macnica, Inc.
Macnica Inc
NeuroBrave
New H3C Group
Nvidia
ルネサスエレクトロニクス株式会社
Samplify
TranSwitch Corporation
Tsinghua Unigroup
中兴通讯股份有限公司
新华三集团
瑞萨
紫光集团
リンク無しの社名は OpenBizGraph 未登録企業
§05

関連図

NETWORK
資本関係 得意先 仕入先 業務提携 銀行・株主 ドラッグで移動 · クリックで詳細へ
§07

ニュース

12 ARTICLES

ADI Product Spotlight: High-Power Hot-Swap Controller with Integrated Power Monitor ↗

ADI has introduced the LTC4287 hot-swap protection IC for safely inserting and removing circuit boards in a live backplane. It optimizes MOSFET protection with dual gate drivers, mult mode startup control, and a circuit-breaker timer. The IC supports monitoring current, voltage, power, energy, temperature, and fault status via SMBus 3.1, PMBus, and an on-board ADC. It also features undervoltage, overvoltage, and fault shutdown functions.

Renesas Electronics acquires Pictorus, simplifying embedded software development ↗

Renesas Electronics completed the acquisition of software developer Pictorus, acquiring a cloud-based behavior modeling platform, enhancing the value of the Renesas 365 platform, and driving the joint development of an electronic system design and full lifecycle management platform with Altium. This move will accelerate software-defined solutions in automotive, robotics, and industrial equipment sectors, improve system verification and development efficiency, and shorten time-to-market.

ADI Launches A²B™ 2.0 In-Car Audio Bus Upgrade ↗

The A²B 2.0 (ADAA245x series) has entered full-scale production, enabling OEM manufacturers and Tier‑1 suppliers to ramp up production. This version delivers a four‑fold bandwidth increase while maintaining a 62 µs low latency, and is compatible with A²B 1.0 cables and connectors, potentially reducing system costs by up to 30%. A²B 2.0 is designed for software‑defined vehicles, supporting Ethernet data tunneling via the Open Alliance SPI (OASPI) interface to further enhance in‑car audio experience.

Renesas Electronics launches third-generation MRDIMM to boost DDR5 memory performance to 16,000 MT/s ↗

Renesas Electronics announced the launch of the third-generation DDR5 multiplexed dual‑rank memory module (MRDIMM), reaching up to 16,000 MT/s, an improvement of about 25% over the second generation. The solution maintains compatibility with existing DDR5 infrastructure while meeting the higher memory bandwidth demands of AI data centers and high‑performance computing. The platform‑based design includes MRCD, MDB, power‑management ICs, and other components, supporting cross‑generation upgrades and accelerating product deployment.

Altera FPGA AI Suite 26.1.1 Fully Released ↗

Altera announced the official launch of the FPGA AI Suite 26.1.1, completing a major upgrade of its AI software platform. The new version introduces a brand-new compiler technology and an AI model space-mapping architecture, enabling neural networks to be directly mapped onto the FPGA hardware layer, achieving ASIC-like optimized AI inference performance while maintaining low latency and determinism. The suite provides core support for physical AI systems such as robotics and real-time autonomous devices, and is suitable for edge AI applications including visual recognition, video analysis, language models, and sensor processing.

Infineon joins NVIDIA MGX AI factory ecosystem ↗

Infineon Technologies announces joining the NVIDIA MGX AI factory ecosystem, providing 800 VDC power supply solutions and supporting an open modular AI server rack architecture. This move will enhance power density and energy efficiency in AI data centers, offering an upgrade path for AI factories in the Agentic AI era.

Renesas Electronics launches 650V bidirectional GaN switch ↗

Renesas Electronics released the first bidirectional switch TP65B110HRU using depletion-mode GaN technology, supporting soft-switching and hard-switching modes, capable of blocking both positive and negative currents in a single device, simplifying power conversion design, and applicable to solar inverters, AI data centers, and electric vehicle chargers.

Infineon XENSIV™ Sensors: Perception and Insight ↗

Infineon offers a range of sensor solutions through its extensive XENSIV™ product portfolio, applied in automotive, electronics, medical, and industrial sectors. The company emphasizes innovation, reliable performance, and high-quality manufacturing, and enhances its system solution capabilities through acquisitions.

Macnica Cytech FY26 Annual Kickoff Conference Successfully Held ↗

On June 26, 2026, Macnica Cytech held its FY26 Annual Kickoff Conference at the JEN Hotel in Qianhai, Shenzhen. The event was attended by over 600 employees both online and offline, reviewing the achievements of the past year and outlining goals and strategies for the new year.

FPGA product lifecycle support extended to 2045 ↗

Altera announced that it will extend the product lifecycle support for its Agilex, MAX 10, and Cyclone V FPGA series to 2045. This move aims to meet the long-term needs of customers in industries such as industrial, communications, aerospace, medical, and transportation, ensuring supply chain stability and reducing the risk of redesign and certification.

§09

出典・更新

SOURCES
↑