Mitsuo Sekiya established Dai-Ichi Seitosho Company, Ltd. in Aga-machi, Kure City, Hiroshima Prefecture.
Aga-machi, Kure City
Production and sales of vitrified grinding wheels begun.
In 1937, Disco Corporation was founded as a grinding wheel manufacturer 'Daiichi Seito' in Aza-cho, Kure City.
Founded
Registered shares on the Japan Securities Dealers Association over-the-counter market
Mitsuo Sekiya established Dai-Ichi Seitosho Company, Ltd. in Aga-machi, Kure City, Hiroshima Prefecture.
Dai-Ichi Seitosho Co., Ltd. reorganized as a limited liability company; head office moved to the Kanda district of Tokyo.
Inanemoto Seitosho Co., Ltd. of Shinagawa Ward, Tokyo, acquired to serve as Tokyo manufacturing facility; head office moved to this location.
Aga Plant partially rebuilt; production of resinoid cutting wheels begun.
Head office and Tokyo plant damaged in World War II bombing.
Plant temporarily closed at end of World War II.
Aga Plant in Kure City resumes production.
Head office relocated to Shibatamachi in Minato Ward, Tokyo.
Abrasive wheel developed to process key part of electricity meters; 100% market share attained.
Head office relocated to Shiba5-chome in Minato Ward, Tokyo.
Japan's first ultra-thin resinoid abrasive wheel developed (thickness 0.13 - 0.14 mm, diameter 100 mm); used to slit fountain pen nibs; mass production begun.
New plant constructed in Hiro-machi, Kure City (current Kure Plant); cutting wheel division of Aga Plant relocated to this new facility.
Company reorganized as a joint-stock corporation.
Ultra-thin (thickness 40 µm) resinoid cutting wheel, MICRON-CUT, developed.
DISCO introduced MICRON-CUT, a cut-off wheel just 40 micrometers thick. MICRON-CUT won the New Product Award, conferred by leading industrial newspaper Nikkan Kogyo Shimbun, as one of the ten most significant new products of 1968.
DISCO ABRASIVE SYSTEMS, INC. established in US.
In 1969, even before the term 'Silicon Valley' was coined, DISCO established there its first overseas subsidiary.
DISCO established its first overseas subsidiary in Silicon Valley.
DAS/DAD slicing machines developed and released.
In 1974, the University of Tokyo requested that DISCO perform cutting in preparation for analysis of a moon rock that had been brought back to Earth by Apollo 11.
University of Tokyo requested that DISCO perform cutting in preparation for analysis of a moon rock that had been brought back to Earth by Apollo 11.
Automatic Scriber/Dicing Saw DAD-2H developed and acclaimed a hit when exhibited at SEMICON West.
Company name changed to DISCO ABRASIVE SYSTEMS, LTD.
NBC-Z blade developed.
Dai-Ichi Seitosho Co., Ltd. took the D, I, S, and CO in its name and became DISCO.
World's first fully automatic dicing saw DFD-2H/S, developed.
Received the 1979 Grand Prix at the Good Company Award from the Medium and Small Business Reserch Institue.
New rotary surface grinder DFG-83H/6, developed.
Market dominated, with 1,000 DISCO dicing saws in operation at 140 companies in Japan and 140 companies in 28 countries overseas. DISCO awarded Certificate of Appreciation by Texas Instruments for excellence of equipment and technical service.
NBC-ZH hub blade developed.
Precision machine maintenance subsidiary DISCO GIKEN (now DISCO ENGINEERING SERVICE) established.
Sales of TURBOCUT dry diamond cut-off wheels.
New head office building built in Ota Ward, Tokyo; registered address transferred to this location.
Kenichi Sekiya was appointed Executive Vice President.
Large-diameter diamond cut-off wheels for cutting road surfaces begun.
When the head office moved to Higashi-Kojiya from Shinagawa in 1984, the number of employees working there was about two hundred.
Mitsuo Sekiya retired from the position of representative director, President.
DFD-3D/8 dual-spindle dicing saw developed.
Fully Automatic Surface Grinder DFG-82IF/8 developed.
Company name changed to DISCO CORPORATION.
DISCO registered with the Japan Securities Dealers Association for trading in the over-the-counter market.
Site of over 100,000 square meters obtained to build Kuwabata Plant.
Switched business strategy to focus strategy and concentrated management resources on core technologies of Disco, such as cutting, grinding, and polishing, and their application technologies
DAD320 and DAD500 Series automatic dicing saws developed.
DFD620 and DFD640 fully automatic dicing saws developed.
In 1992, DISCO initiated a special new project. The goal was to completely revamp major equipment models in time for the SEMICON Japan trade show to be held one year later. Fifteen members averaging 25 years of age participated. A section head at a large device maker, stationed at a plant in Kyushu, had originally come to DISCO with a challenge: "We want to put the equipment for each process together, in one big U-shaped production line, so that a single person can operate them all at once. So we need smaller, cheaper manual dicing saws. If you can do this, we’ll take 200 units". With this challenge, a project was launched to implement a model change, including the development of a manual dicing saw, which previously had not been planned. The project members worked hard day and night. A year after the launch of the project and after having made some remarkable changes to the equipment, they were able to display a total of 10 units at SEMICON Japan—fully automatic dicing saws DFD620 and DFD640, semi-automatic grinder DAG110, and semi-automatic dicing saw DAD320. The project was complete, and the section head at the aforementioned device maker was promptly contacted. Unfortunately, he had been transferred to Malaysia and, despite his continued enthusiasm, could only issue an order for 10 units. But it didn't matter. Although the plan had not gone as expected, the new, smaller equipment was an immediate hit around the world.
Introduced Amoeba management accounting method
In 1992, DISCO initiated a special new project.
DFD650 dual-spindle dicing saw developed.
Received certification from the German Technical Inspection Association (TUV), an EU-approved safety standards review and certification body, and began displaying CE marks on shipping equipment for Europe
A year after the launch of the project and after having made some remarkable changes to the equipment, they were able to display a total of 10 units at SEMICON Japan—fully automatic dicing saws DFD620 and DFD640, semi-automatic grinder DAG110, and semi-automatic dicing saw DAD320.
ISO 9002 (quality management) certification acquired for precision diamond division.
CE mark certification received from TUV (recognized testing lab of the EC) for machines bound for Europe.
Launched the 'Disco Future Project Alpha' internal newsletter created to communicate the purpose and significance of activities. As a result of rapid company growth, employee numbers exceeded 750, and personnel from various industries with diverse values and corporate cultures joined annually. Management felt it was difficult to share a common understanding among these diverse personnel, so they organized and reaffirmed Disco's core values, and began restructuring organizational management and creating a corporate culture. Achieved ISO 9001 quality management system certification as a PS division
ISO 9001 (quality management) certification acquired for PS operating division.
in 1995, DISCO launched Future Project Alpha, aimed at top management.
Adopted specifications meeting both CE mark and SEMI standards as standard for equipment. SEMI standards are international industrial standards for the semiconductor industry established by Semiconductor Equipment and Materials International. To provide safety as a value to customers and meet the requirements of all customers worldwide, Disco set the standard specifications to meet both CE mark and SEMI standards. This philosophy was inherited in the later 2002 'Disco Product Identity,' which states that products are 'the most rigorous standards-compliant products within the country of use.'
Built and began sharing the corporate value 'DISCO VALUES' internally. Over two years, the first edition of 'DISCO VALUES' was completed through the Disco Future Project. It clarifies Disco's societal role (Mission) and the corporate image (Target) needed to achieve this Mission. The Mission is to connect distant science to everyday comfort through advanced cutting, grinding, and polishing technologies. The Target is for Disco's technology and services to become international standards, appreciated worldwide, making all corporate activities first-class and ensuring Disco's presence is welcomed by society and stakeholders. 'DISCO VALUES' are distributed to all employees in a binder format.
DISCO Values was established and shared within the company.
Obtained ISO 14001 environmental management system certification at Hiroshima plant
in December 1997, DISCO introduced DISCO Values to employees.
Hitoshi Mizorogi was appointed as Executive Vice President.
ISO 14001 (environmental management) certification received for Hiroshima Works.
300 mm-compatible dicing saws and grinders developed.
Listed shares on the Tokyo Stock Exchange First Section
Started customer satisfaction survey (CS survey). It is conducted via questionnaires to understand customer feedback, an important initiative.
DISCO shares listed on First Section of Tokyo Stock Exchange.
DISCO HI-TEC AMERICA, INC. obtained ISO 9001 certification
Shinji Sekiya retired from the position of representative director and Vice Chairman.
Nagatani Plant built in Kure City, Hiroshima Prefecture.
New series dicing saws, DFD6350 and DFD6360, and new series grinder, DFG8540, developed.
Started supplier satisfaction survey (SS survey)
Hitoshi Mizorogi was appointed as President.
Kenichi Sekiya was appointed as Chairman of Semiconductor Equipment and Materials International (SEMI).
Dry polishing process developed; world's first dry polisher, DFDP8140, and dry polishing wheels released.
New grinding wheel series, GF01, developed.
Disco's purchasing stance
Buyer's pledge
Formulated Disco Product Identity
300 mm-compatible Fully Automatic Laser Saw DFL7160 developed.
Initiated Will accounting. Managed expenses with a new category called 'will expenses' in addition to fixed and variable costs in management accounting, reducing will expenses during profit downturns to secure profits. Implemented 'pain charging' for inefficiency improvements and 'Will rewards' for efficiency gains to encourage further contributions. This system applies to all company departments, enhancing overall profit awareness and governance over expenses.
Started employee satisfaction survey (ES survey). Conducted anonymously to improve working environments, including overseas subsidiaries, and used feedback to energize workplaces, develop subordinates, and enhance job satisfaction.
Start of PIM (Performance Innovation Management) activities. Improvement activities in the Disco style. Draw the ideal state and goals of operations, set target values (indicators) to measure evolution, and if not achieved, delve deeper by repeatedly asking 'why', promote awareness, change methods, and if achieved, set new goals, aiming for continuous evolution and improvement of operations.
8"-compatible Fully Automatic Dicing Saw DFD6240 developed.
Obtained OHSAS 18001 certification.
Formulated Environmental Vision 2010.
Formulated Green Product Guidelines.
Relocated and newly constructed headquarters and R&D Center in Omori, Ota Ward, Tokyo (seismic structure).
Introduced new childcare support system.
OHSAS 18001 certification received for Hiroshima Works.
Head office and R&D center was relocated to 13-11 Omori-kita 2-chome, Ota-ku, Tokyo.
New DISCO company logo was introduced.
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.
DAD3230
New dicing blade series ZH05 and Z05, new grinding wheel Poligrind and a new grinding wheel bond BT100 for the GF01 Series developed.
After the head office moved to Omori-Kita in 2004, all of DISCO's core facilities, such as administration, R&D, application lab and service departments, were in the same building.
Expanded ISO 14001 certification scope to all domestic bases.
In November 2004, DISCO relocated from Higashi-Kojiya(Tokyo, Ota-ku), which had been its base for nearly twenty years, to the new head office and R&D center in Omori-Kita(Tokyo, Ota-ku).
Consolidation with the maintenance and service subsidiary DISCO ENGINEERING SERVICE, LTD.
Developed dicing application using ultrasonic wave.
Developed a backgrinding processing method called 'TAIKO'.
Kenichi Sekiya retired from the position of representative director and Chairman. And He was appointed as Honorary Chairman.
Expanded ISO14001 certification to all factories in Japan.
Shinano Denki became a subsidiary and changed name to Daiichi Components.
Laser processing technology to improve production of high-intensity LED developed.
Introduced subsidy system for infertility treatment costs.
Completed new seismic structure at Kure Factory (precision processing tool production base).
Kenichi Sekiya appointed as Director Emeritus of SEMI.
Developed the DFL7340/7360 laser saws based on a business alliance with Hamamatsu Photonics.
Developed the DFD6362 dicing saw for 300 mm wafer processing.
Developed the DP08 Series dry polishing wheel.
Developed the DGP8761 grinder/polisher for 300 mm wafer processing and the DFM2800 multi-wafer mounter.
Obtained
Obtained certification for Business Continuity Management System standard 'BS25999-2:2007'.
Started internal recruitment system.
Achieved zero wastewater discharge for dicing saws.
Developed pure water recycling device 'DWR1720'.
Completed construction of building at Head Office R&D Center (B-Building).
Obtained certification for Business Continuity Management System Standard (BS25999-2: 2007).
Developed the DWR1720 deionized water recycling unit, which produces zero wastewater, for use with dicing saws.
Developed the DDS2300 fully automatic die separator.
Opened 'Disco Omori Nursery Room'.
Hitoshi Mizorogi was appointed as Chairman and CEO, and Kazuma Sekiya was appointed as President and COO.
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.
Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance.
Formulated Biodiversity Action Guidelines.
Started 'Pandemic Program' project.
Announced 'DISCO VISION 2020'.
Completion of a new building at the Kuwabata plant.
Completion of a new building at the Chino plant.
Established a service office in Vietnam.
Developed the DWR1721 Deionized Water Recycling Unit with drain water pumping and communication functions with the dicing saw.
Ranked 8th in the 'Company with the Most Attractive Work Environment' ranking.
Announced 'Environmental Vision 2020'.
Start of the "Personal Will Accounting System"
Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers.
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.
Developed the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers.
Selected as No. 11 in the "Company with a Good Working Environment" ranking
Japan's first certification of the Business Continuity Management System standard "ISO 22301:2012"
Start of the "PIM Rank Improvement Program"
Start of the "Application University"
Start of the "Global Challenge System"
Completed construction of building at Kure Plant (C-Building).
Established a service office in the Philippines.
Became the first Japanese company to earn certification under the ISO 22301:2012 Business Continuity Management System Standard.
Selected as No. 7 in the "Company with a Good Working Environment" ranking
Announcing health level 1 and starting health management initiatives
Developed the DFL7361, stealth dicing laser saw, for ø300 mm wafers with support for various processes.
Selected as No. 10 in the "Company with a Good Working Environment" ranking
Formulation of the "Disco Labor Safety and Health Policy"
Start of the "Will Bonus"
Start of the "Freedom of Transfer"
Transfer of all owned shares in consolidated subsidiary company TECNISCO LTD..
Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality.
Developed DPEG-MZ, a gettering DP wheel to improve die strength.
Developed ZH14 series hub blades for stable processing under high load conditions.
Introducing the DWR1722, a DI water recycling unit with high customizability, and StayClean-R, a cutting water additive which can be used in conjunction with the DWR series.
Start of the "Free Choice of Work Locations"
Establishment of the "Nomination and Compensation Advisory Committee"
Introduction of a personnel system where maternity and childcare leave do not hinder career advancement (promotion)
Introduction of the "Self-Assessment System" regarding the effectiveness of the Board of Directors
Completed construction of building at Kuwabata Plant (Zone B, A-Building).
Implementation of a free-choice work location system.
Developed the DAD3660, a dual spindle automatic dicing saw with support for workpieces as large as 360 mm x 360 mm.
Developed a unique laser-lift off optimal for high brightness vertical structured LED manufacturing.
Selected as No. 6 in the "Company with a Good Working Environment" ranking
Decided and notified the entire company to prohibit discrimination based on gender identity and sexual orientation, including LGBT
First holding of the "DISCO presents Discovery Channel Programming Contest"
Change of the scope of external certification acquisition for "ISO 14001" to only Hiroshima Office
In February 2015, construction was completed on the new building at DISCO's largest manufacturing affiliate, Kuwabata Plant (Kure City, Hiroshima Prefecture). The official name of the new building is "B Zone, A Building, Kuwabata Plant". The building serves as a structure for housing large equipment, and is the same size as A Building. Around the same time, road construction around the plant progressed, allowing the Kuwabata Plant to be seen from places that were previously inaccessable. Seeing the tall mountains and the eight story Kuwabata Plant, far removed from inner Kure City, is truly breathtaking.
In March, one month after the completion of the new building, the "Higashihiroshima, Kure Expressway" was fully opened, connecting the Sanyo Expressway and the Aga region near DISCO's Kure Plant. An interchange for the expressway was also built just next to Kuwabata Plant. The expressway can now be used for the majority of the trip when travelling from Hiroshima Airport to the Kuwabata Plant and Kure Plant. Easier access to the plants for both DISCO employees and for customers visiting the plants from within Japan and from overseas is long-awaited good news for DISCO.
Held the first “DISCO Presents Discovery Channel Code Contest”.
Developed KABRA® , a new laser slicing technology.
Developed fully automatic polisher that supports CMP of difficult-to-process materials, including sapphire.
Developed DFD6310, a panel level packaging compatible dicing saw.
Ranked 4th in the 'Companies with Good Working Environment' ranking
Held a seminar on childcare systems for male employees (Paternity briefing)
Held the 'Disco Programming Contest @HIROSHIMA'
Introduced a system for taking paid leave in hourly units
Held the first “DISCO Presents Discovery Channel Code Contest".
Received recognition from Health & Productivity Management Outstanding Organizations Recognition Program (White 500).
Received CEATEC Award 2017 for KABRA® process.
Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers.
Developed parallel processing transfer system for realizing efficient wafer processing.
Developed DFL7362, a stealth dicing laser saw that achieves higher throughput.
Developed KABRA!zen® , a full-automatization of KABRA® laser slicing technology.
Ranked 4th in the 'Companies with Good Working Environment' ranking
Certified as a 'Health & Productivity Management Outstanding Organization (White 500)' in 2017
Received the Grand Prize (Minister of Health, Labour and Welfare Award) at the 1st 'Workplace with High Productivity and Ease of Working' Awards
Ranked 4th in the women's category of the 'Companies with Good Working Environment'
Nagano Business Office and Chino Factory commence operations
Established the 'CEO Evaluation Committee'
Obtained certification for the international standard ISO/IEC17025:2017 related to calibration.
Completed construction of new Kyushu Branch building and relocated.
Began operations at Nagano Works Chino Plant.
Developed DFG8640, a fully automatic grinder compatible with Φ8-inch wafers, which achieves high-precision processing of difficult-to-grind materials.
Model change for all four semi-automatic dicing saw models.
Developed a system for monitoring and control of precision processing equipment using a smartphone or other device.
Received the Excellence Award at the 10th 'Work-Life Balance Awards'
Developed and issued the first Japanese Industrial Standards (JIS) 'Employee Satisfaction Standard JSA-S1001' through corporate proposals
Established a global consultation desk for harassment issues
Completed construction of building at Kuwabata Plant (Zone C, A-Building).
Chosen for the Health & Productivity Stock Selection Program for the first time.
Certified as a “Tokyo Model Company for Promotion of Stranded Commuter Prevention”.
Became the first company to develop and publish a JSA standard, “Employee Satisfaction Standards JSA-S1001”.
Relocated USA Office in California.
Developed DAD3351, DAD3361, and DAD3431. All semi-automatic dicing saw models were remodeled.
DDS2320, a fully-automatic die separator, was developed.
Cluster system "MUSUBI" and three compatible equipment models added to product lineup.
Ranked 3rd in the 2019 'Companies with Good Working Environment' ranking
Ranked 3rd in the 2019 'Women' category of the 'Companies with Good Working Environment'
First selected as a 'Health & Productivity Stock'
Consecutively certified as a 'Health & Productivity Management Outstanding Organization (White 500)' for three years in a row in 2019
Kuwabata Plant, Hiroshima Works won the 8th "Green Society Contribution Award".
Received the "Ministerial Award for Regional Revitalization Support Tax System (Corporate Hometown Tax Payment)" from the Cabinet Office.
Developed DIS100, an inspection system.
Developed fully-automatic grinders DFG8020 and DFG8030.
Hiroshima Business Office Kuwabatake Factory received the 8th 'Green Social Contribution Award'
Received the 'Ministerial Award' from the Cabinet Office for the 'Regional Revitalization Support Tax System (Corporate Version Furusato Nozei)'
Selected as a 'Health & Productivity Stock' for two consecutive years
Certified for four consecutive years in the
An outside director has been appointed as chairman of the Nomination and Compensation Advisory Committee.
As a greenhouse gas reduction target, the medium-term goal is to achieve carbon neutrality of Scope 1+2 emissions related to the company's operations by fiscal year 2030, and the long-term goal is to achieve carbon neutrality of Scope 1+2+3 emissions across the entire supply chain by fiscal year 2050.
Completed construction of Building B at Chino Plant.
Completed construction of Building A, Zone D at Kuwabata Plant, and completed expansion work for Building A.
Ranked third in the 2021 'Great Place to Work' ranking.
Ranked fifth in the 2021 'Great Place to Work' Women ranking.
Ranked third in the 2021 'Great Place to Work' Young Talent ranking.
Certified as a 'Healthy Management Excellence Corporation (White 500)' for five consecutive years.
Transitioned from the First Section to the Prime Market of the Tokyo Stock Exchange following a market classification review.
Formulated 'DISCO VISION 2030'.
Appointment of a female director.
Transition to a company with a Nomination Committee and other committees.
Initiated the establishment of a system compliant with the RBA Code of Conduct.
Supported the TCFD recommendations and began disclosing information in line with those recommendations.
Established the Haneda R&D Center at Higashikojiya, Ota-Ku, Tokyo.
Ranked fourth in the 2022 'Great Place to Work' ranking.
Ranked third in the 2022 'Great Place to Work' Women ranking.
Ranked fourth in the 2022 'Great Place to Work' Young Talent ranking.
Certified as a 'Healthy Management Excellence Corporation' for six consecutive years.
Formulated a Sustainability Procurement Policy.
Launched a diversity training program for all employees.
Established a 'Commitment Allowance'.
Formulation of the Multi-Stakeholder Policy
Establishment of the Stock Holding Guidelines
Formulation of the Tax Policy
Established the Mid-Process Research Center in Mashikimachi, Kamimashiki-gun, Kumamoto.
Completed construction of new Osaka Branch office building and relocated.
Released DFD6342, an 8-inch compatible, fully automatic dicing saw.
Developed DDS2020, a die separator for highly rigid materials including SiC.
Developed DAG811, an automatic grinder that achieves improved usability and a smaller footprint.
Developed ZHSR series (hub blades for silicon wafer dicing), TM22 series (highly rigid metal bond blades), and BH23 series (metal/resin bond blades compatible with automatic blade changer).
Developed DPEG series SZ Type, a gettering DP wheel for silicon wafers.
Ranked 8th in the 2023 'Great Place to Work' ranking
Ranked 3rd in the 2023 'Great Place to Work' Women Ranking
Certified as a 'Healthy Management Excellence Corporation' for 7 consecutive years
Ranked 1st in the 2023 'Great Place to Work' Senior Ranking
Received the Nikkei Business Human Capital Disclosure Award – Development Division, Runner-up
Obtained Platinum certification in the RBA VAP audit
Implementation of the Restricted Stock Compensation System
Formulation of the Board Composition and Gender Diversity Policy
Introduction of Mars and Cloverback
Obtained independent third-party assurance on greenhouse gas emissions (Scope 1 and 2)
Hiroshima Works and Nagano Works earned platinum status in the RBA VAP Audit.
Established a service office in India.
Developed KABRA® process that realizes large-diameter diamond wafer manufacturing.
Developed DDS2030, a die separator for small die devices.
Developed DFD6370, a dicing saw that supports package processing of up to 330 mm square substrates.
Developed ZHSC25 series (dicing blades for SiC) and Z25 series (dicing blades for electric components).
Developed DWR1730, a deionized water recycling unit that can handle large flow rates such as those used in grinders.
Developed DKL7640 which achieves more efficient GaN wafer production using the KABRA® process.
Ranked 5th in the 2024 'Great Place to Work' ranking
Ranked 1st in the 2024 'Great Place to Work' Women Ranking
Certified as a 'Healthy Management Excellence Corporation' for 8 consecutive years
Ranked 2nd in the 2024 'Great Place to Work' Young Talent Ranking
Ranked 11th in the 2024 'Great Place to Work' Asia Ranking
Ranked 1st in the 2024 'Great Place to Work' Senior Ranking
Formulation of the Human Rights Policy
Developed KABRA process that realizes large-diameter diamond wafer manufacturing.
Developed DKL7640 which achieves more efficient GaN wafer production using the KABRA process.
Ranked 4th in the 2025 'Company with a Great Work Environment' ranking.
Ranked 1st in the 2025 'Company with a Great Work Environment' women's ranking.
Ranked 1st in the 2025 'Company with a Great Work Environment' young employees ranking.
Ranked 9th in the 2025 'Company with a Great Work Environment' Asia ranking.
Ranked 2nd in the 2025 'Company with a Great Work Environment' senior ranking.
Disco Corporation denies the information circulated on social media and other platforms that it was subject to export controls related to semiconductor manufacturing equipment as of August 1, 2026, and states that it will continue to comply with laws and regulations, issuing an official statement based on facts.
Disco Corporation denies the information circulating on some social media that it was subject to export controls related to semiconductor manufacturing equipment as of August 1, 2026. They are currently consulting with the Ministry of Economy, Trade and Industry, and will provide further guidance once confirmed. The company will continue to supply products and provide services in compliance with laws and regulations.
Due to the Kumamoto earthquake, there were no personnel casualties at our headquarters or production sites, and the buildings with seismic isolation structures were unharmed. Our Kyushu branch continued operations without damage. Procurement and shipping proceeded normally, and we have established a support system for customers in the Kumamoto region. We will publish information about any future changes on our website.
Disco Corporation was selected as the No.1 company in the 2026 'Companies with Good Work Environment' Young Employees' Ranking. It has ranked within the top 5 for seven consecutive years, and its environment that supports employees' career choices is highly evaluated.
At the Board of Directors meeting on June 24, 2026, it was resolved that Mr. Akira Mei will be appointed as a new Executive Officer.
Disco Corporation announced that the total shipments of laser saws exceeded 4,000 units in February 2026, with the shipment pace accelerating approximately threefold since 2020.
Disco Corporation has been recognized for its efforts to improve employee satisfaction and was selected as No.1 in the 2026 edition ranking for the first time.
Disco Inc. received the 'Winner Company' award for its management leveraging corporate governance and its mid‑to‑long‑term growth.
Disco Inc. introduced a system in July 2023 that pays a monthly allowance of 100,000 yen to employees who commit to self‑assessing and maintaining value creation and trust relationships.
Disco Corporation has developed a fully automatic dicing saw 'DFD6080' capable of cutting packages up to 400mm square, and announced it in December 2025.