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§05
Network
NETWORK
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§06
History
27 EVENTS
Founded in 1979 as 'Towa Precision Industry Co., Ltd.', our company has proposed numerous new technologies and significantly contributed to the industry's development.
Established a temporary factory in Yawata City, Kyoto Prefecture, began operations, and simultaneously opened a Tokyo sales office.
Successfully prototyped a fully automatic multi-plunger semiconductor resin sealing device, opening the way to high-quality mass production technology for semiconductor resin sealing.
Established the TOWA Comprehensive Technology Center.
Moved headquarters to 122-2, Megawa, Makishima-cho, Uji City, Kyoto Prefecture, and changed the company name to TOWA Co., Ltd.
Moved headquarters to 122-2, Megawa, Makishima-cho, Uji City, Kyoto Prefecture, and changed the company name to TOWA Co., Ltd.
Registered the company emblem as a Japanese trademark.
Made Namwa Seiko Co., Ltd. (now TOWATEC Co., Ltd.) a subsidiary.
Established the Kyoto East Office in Ujitawara-cho, Tsuzuki-gun, Kyoto Prefecture (overall completion in June 1992). Made Bandic Co., Ltd. a subsidiary. In April, made Micro Component Technology Malaysia Sdn. Bhd. (now TOWAM Sdn. Bhd.) a subsidiary.
Invested capital in East Shin Co., Ltd. of South Korea.
Listed on the Second Section of the Osaka Stock Exchange and the Kyoto Stock Exchange.
Completed and relocated headquarters and factory to 5-5, Kamitobajou, Naka-ku, Kyoto City.
Obtained ISO 9001 certification for headquarters, factory, and Kyoto East Office.
Obtained ISO 9001 certification for headquarters, factory, and Kyoto East Office.
Established the Kyushu Factory (now Kyushu Office) within the 'Tsuru North Hill New City' in Tsuru City, Saga Prefecture.
Obtained ISO 9001 certification for the Kyushu Factory (now Kyushu Office).
Listed on the First Section of the Osaka Securities Exchange.
Listed on the First Section of the Tokyo Stock Exchange.
Obtained ISO14001 certification at headquarters and factory.
Obtained ISO9001 certification at TOWAM Sdn. Bhd.
Obtained ISO14001 certification at Kyoto East Office, Kyushu Office, and Tokyo Sales Department (now Tokyo Sales Office).
Obtained ISO14001 certification at TOWAM Sdn. Bhd.
Acquired a capital stake in Shanghai Sadik Software Co., Ltd. in China.
TOWA Korea Co., Ltd. acquired the molding business of SEMES Co., Ltd.
Acquired shares of Omron Laser Front Co., Ltd. (now TOWA Laser Front Co., Ltd.) and made it a subsidiary.
Acquired shares of Fine International Co., Ltd. (now TOWA Fine Co., Ltd.) and made it a subsidiary.
Some related information includes details such as "Total Solution Service".
§07
News
14 ARTICLES
TOWA Establishes New R&D Hub in Keihanna Science and Technology City
TOWA has secured a business site in Keihanna Science and Technology City, Kyoto Prefecture, through a long-term lease to strengthen its research and development system and human resource development. The company is advancing technology and product development for advanced semiconductors and next‑generation packaging, while investing in human resources and nurturing talent through the "TOWA Academy".
Personnel Changes Effective October 1, 2025
TOWA Corporation announced personnel changes effective October 1, 2025. Mr. Kazuhiko Nakanishi will concurrently serve as Director of the Sustainability Promotion Office, and Mr. Kitaro Okamoto will concurrently serve as Director of the Singulation Technology Department. Mr. Jitsu Natsume will become Deputy Head of the Core Technology Business Division and Head of the Tool & Engineering Sales Department, while Mr. Toshikazu Fukushima will assume the role of Director of the Production Headquarters Customer Support Technology Department. Additionally, the Production Headquarters Quality Management Department will be renamed to the Customer Support Technology Department.
Samco and TOWA Hold "Kyoto Day" in New Delhi
Samco and TOWA held a joint technical seminar "Kyoto Day" on September 1, 2025, in New Delhi, India, with more than 50 customers and stakeholders in attendance. The event was held prior to the international exhibition SEMICON India and focused on Japanese semiconductor technology, featuring speeches by the representatives of both companies and a special lecture by a professor from IIT Delhi.
Issuance of Restricted Stock Compensation Shares Completed Payment
The payment procedures for the newly issued shares, granted as restricted stock compensation, were completed on August 19, 2025. A total of 16,811 common shares were issued, with a total issuance amount of 32,646,962 yen, allocated to six directors and five executive officers.
Samco and TOWA Hold Joint Technology Seminar in New Delhi
Samco and TOWA will hold a joint technology seminar "Kyoto Day" in New Delhi on September 1, 2025, in conjunction with SEMICON India. Approximately 100 participants, mainly customers of both companies, are expected to attend, where the latest technological trends and solutions related to semiconductor manufacturing will be presented.
Issuance of New Shares as Restricted Stock Compensation
On July 24, 2025, TOWA resolved to issue 16,811 common shares as restricted stock compensation. The payment date is August 19, the issue price is ¥1,942 per share, and the total issue amount is ¥32,646,962. The shares are allocated to six directors and five executive officers, aiming to provide incentives for sustained improvement of corporate value and to share value with shareholders.
Personnel Changes Effective July 16
TOWA announced personnel changes effective July 16, 2025. Mr. Itaro Okamoto was appointed as Head of the Singulation Business Division and Head of the Singulation Development Division, and Mr. Naoki Hamada was appointed as Head of the Singulation Sales Division of the same division.
Announcement of Executive Officer Personnel Changes
TOWA Corporation announced the executive officer personnel changes effective July 1, 2025. Mr. Miura Munetaka, Mr. Ishida Koichi, Mr. Shibahara Nobutaka, and Mr. Nishimura Ichio were reappointed, with Mr. Ishida becoming Senior Executive Officer, Mr. Shibahara becoming Executive Officer, and Mr. Nishimura becoming Senior Executive Officer.
Established Cutting Technology Unrestricted by Package Shape
TOWA, in collaboration with its subsidiary TOWA Laser Front, has established a new laser-based singulation technology. It accommodates various arrangements and non-rectangular package shapes, contributing to reduced manufacturing costs, increased productivity, and greater design freedom. By using dry cutting, the water usage in the singulation process is reduced by 100%.
TI Company Wins 2024 Supplier Award
TOWA Corporation received the "2024 Texas Instruments Supplier Excellence Award" from Texas Instruments. The award recognized outstanding achievements in technological innovation, collaborative efforts, and excellence in cost, quality, and supply assurance, selecting TOWA as one of 19 companies chosen from over 10,000 suppliers worldwide.
§08
Public records
GOV
National Tax Agency basic information7130001011258
Source: National Tax Agency Corporate Number Publication Site, basic three items
Trade name
TOWA株式会社
Trade name (kana)
トーワ
Name in English
TOWA CORPORATION
Corporation type
301
Address
〒601-8105 京都府京都市南区上鳥羽上調子町5番地
Postal code
6018105
Prefecture code
26
City code
107
Address outside Japan
Prefecture in English
Kyoto
City in English
KAMITOBAKAMICHOSHICHO 5, KYOTO SHI MINAMI KU
Address outside Japan in English
Corporate number assignment date
2015-10-05
Update date
2024-07-11
Change date
2015-10-05
Registry closure date
Reason for registry closure
Successor corporate number
Details of the change
Latest record
1
Excluded from search
0
Processing type
01
Correction type
1
Trade name image ID
Address image ID
Sequence number
3945983
METI gBizINFO7130001011258
Source: gBizINFO (Ministry of Economy, Trade and Industry)